151. A Bond-Graph Metamodel
- Author
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Cobos Mendez, Reynaldo, de Oliveira Filho, Julio, Dresscher, Douwe, Broenink, Jan, Arbab, Farhad, Jongmans, Sung-Shik, and Robotics and Mechatronics
- Subjects
0209 industrial biotechnology ,Interface (Java) ,Modeling language ,business.industry ,Computer science ,Cyber-physical systems ,Distributed computing ,Component software ,22/2 OA procedure ,0211 other engineering and technologies ,02 engineering and technology ,Modular design ,Metamodeling ,020901 industrial engineering & automation ,Composability ,Component (UML) ,Component-based software engineering ,Power port ,business ,Bond-graph ,021106 design practice & management ,Reusability - Abstract
Composability and modularity in relation to physics are useful properties in the development of cyber-physical systems that interact with their environment. The bond-graph modeling language offers these properties. When systems structures conform to the bond-graph notation, all interfaces are defined as physical “power ports” which are guaranteed to exchange power. Having a single type of interface is a key feature when aiming for modular, composable systems. Furthermore, the facility to monitor energy flows in the system through power ports allows the definition of system-wide properties based on component properties. In this paper we present a metamodel of the bond-graph language aimed to facilitate the description and deployment of software components for cyber-physical systems. This effort provides a formalized description of standardized interfaces that enable physics-conformal interconnections. We present a use-case showing that the metamodel enables composability, reusability, extensibility, replaceability and independence of control software components.
- Published
- 2020
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