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Heat dissipation issues are the emerging challenges in the field of flexible electronics. Thermal management of flexible electronics creates a demand for flexible materials with highly anisotropic thermal conductivity, which work as heat spreaders to remove excess heat in the in-plane direction and as heat shields to protect human skin or device components under them from heating. This study proposes a self-assembled silver nanowire network with high thermal and electrical anisotropy with the potential to solve these challenges. The in-plane thermal conductivity of the network along the axial direction of silver nanowires is measured as 37 W/m-K while the cross-plane thermal conductivity is only 0.36 W/m-K. The results of measurements of electrical and thermal conductivities suggest that abundant wire-wire contacts strongly impede thermal transport. The excellent alignment of nanowires results in the same anisotropy ratio of 3 for both thermal and electrical conduction in the two in-plane directions. The ratio remains unchanged as the temperature decrease to 50 K, which indicates that wire-wire contacts lower the thermal and electrical conduction in the two directions to the same extent and their effect is independent of temperature. In addition, phonon softening markedly reduces the Debye temperatures of the network, which are fitted from the electrical resistivity data. As a result of phonon thermal conduction, the Lorenz numbers of the film in the two directions, which are approximately the same, are larger than the Sommerfeld value at room temperature and decrease as temperature decreases because of small angle scattering and the reduced phonon contribution. This nanowire network provides a solution to the emerging challenges of thermal management of flexible electronics.

We consider the problem of identifying current coupons for Agency backed To-be-Announced (TBA) Mortgage Backed Securities. In a doubly stochastic factor based model which allows for prepayment intensities to depend upon current and origination mortgage rates, as well as underlying investment factors, we identify the current coupon with solutions to a degenerate elliptic, non-linear fixed point problem. Using Schaefer's theorem we prove existence of current coupons. We also provide an explicit approximation to the fixed point, valid for compact perturbations off a baseline factor-based intensity model. Numerical examples are provided which show the approximation performs remarkably well in estimating the current coupon., Comment: 2 figures

Silver nanowires have great application potential in fields like flexible electronic devices, solar cells and transparent electrodes. It is critical and fundamental to study the thermal and electrical transport properties in a single silver nanowire. In this work, the thermal and electrical transport in an individual silver nanowire is characterized down to 35 K with the steady state electro-thermal technique. The results indicate that, at room temperature, the electrical resistivity increases by around 4 folds compared from that of its bulk counterpart. After fitting the temperature dependent electrical resistivity curves with the Bloch-Gr\"uneisen formula, the Debye temperature (151 K) of the silver nanowire is found 36% lower than that (235 K) of bulk silver, confirming strong phonon softening. The thermal conductivity is reduced by 55% compared with that of its bulk counterpart at room temperature and this reduction becomes larger as the temperature goes down. To explain the opposite trends of thermal conductivity (\k{appa}) ~ temperature (T) of silver nanowire and bulk silver, a unified thermal resistivity is used to elucidate the electron scattering mechanism. A large residual unified thermal resistivity for the silver nanowire is observed while that of the bulk silver is almost zero. The same trend of variation against T indicates that the silver nanowire and bulk silver share the same phonon-electron scattering mechanism. Additionally, due to phonon-assisted electron energy transfer across the grain boundaries, the Lorenz number of the silver nanowire is found much larger than that of bulk silver and decreases with decreasing temperature.

This work reports on the first-time study of the temperature-dependent behavior of the Lorenz number of bio-supported average 3.2 nm-thin Ir film down to 10 K. Due to the strong imperfection-electron scattering, a very large residual resistivity is observed for the film that dominates the overall electron transport. The Debye temperature (221 K)of the film is found much smaller than that of bulk (308 K). This phonon softening strongly confirms the extensive surface and grain boundary electron scatterings. More than one order of magnitude reduction is observed for the thermal conductivity of the film. We find the Wiedemann-Franz Law still applies to our film even at low temperatures. The overall Lorenz number and that of imperfection structure are close to the Sommerfeld value and shows little temperature dependence. This is contrast to other studied low dimensional metallic structures that have a much larger Lorenz number. Electron tunneling and hopping in the biomaterial substrate are speculated responsible for the observed Lorenz number., Comment: arXiv admin note: text overlap with arXiv:1410.0737

Thermal energy transport is of great importance in lignocellulose pyrolysis for bio-fuels. The thermophysical properties of lignocellulose significantly affect the overall properties of bio-composites and the related thermal transport. In this work, cell-scale lignocellulose (mono-layer plant cells) is prepared to characterize their thermal properties from room temperature down to 41 K. The thermal conductivities of cell-scale lignocellulose along different directions show a little anisotropy due to the cell structure anisotropy. It is found that with temperature going down, the volumetric specific heat of the lignocellulose shows a slower decreasing trend against temperature than that of microcrystalline cellulose, and its value is always higher than that of microcrystalline cellulose. The thermal conductivity of lignocellulose decreases with temperature from 243 K to 317 K due to increasing phonon-phonon scatterings. From 41 K to 243 K, the thermal conductivity rises with temperature and its change mainly depends on the heat capacity's change.

By studying the temperature-dependent behavior of electron thermal conductivity (k) in a 3.2 nm-thin film, we quantify the extremely confined defect-electron scattering and reveal the intrinsic phonon-electron scattering that is shared by bulk Ir. At low temperatures below 50 K, the thermal conductivity of the thin film has almost two orders of magnitude reduction from that of the bulk Ir. The thermal conductivity of the film increases with increasing temperature while that of the bulk Ir has an opposite trend. We introduce a unified thermal resistivity to interpret this completely different k-T relation. This residual thermal resistivity provides an unprecedented way to quantitatively evaluating defect-electron scatterings in heat conduction. The interfacial thermal conductance across the grain boundaries is found larger than that of the Al/Cu interface. Its value is proportional to temperature largely because of the electron's specific heat. A unified interfacial thermal conductance is defined and firmly proves such relation. The electron reflection coefficient is found to be large (88%) and almost temperature independent. This means most of the electrons which scatter with the grain boundary would be reflected back and the scatterings are not affected by temperature.