151. Improving the quality and digestibility of wheat flour starch and protein for noodles through ultrasound, high hydrostatic pressure, and plasma technologies: A review.
- Author
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Ahmed Z, Uddin N, Latif A, Tufail T, Qayum A, Manzoor MF, Khan KA, Ashraf J, Khalid N, and Xu B
- Abstract
The production of high-quality noodles relies on using premium-quality wheat flour. There is growing interest in using nonthermal technologies (NTTs), like ultrasound, high hydrostatic pressure (HHP), and plasma techniques, to enhance the nutritional properties of wheat flour starch and protein, specifically its digestibility. This review compiles the impact of these nonthermal technologies on wheat flour characteristics for optimal noodle preparation. Ultrasound applications can modify protein networks and starch granules in wheat flour, resulting in improved consistency and texture of noodles. High hydrostatic pressure (HHP) treatments have been observed to effectively alter protein specificity, thereby forming desirable textural attributes such as hardness and firmness. Consequently, this process significantly contributes to the overall improvement in the quality of the noodles. Additionally, HHP treatments promote gelatinization within structures, improving noodle digestibility. On the other hand, plasma treatment modifies the structure and properties of gluten, enhancing dough rheology and stability and improving the texture, nutrition, and sensory attributes of noodles. The modifications induced by ultrasound HHP and plasma treatments in gluten structure enzymatic potential, starch granules, and protein functionality collectively enhance noodle characteristics. Furthermore, the modifications efficiently improve digestibility and increase nutrient availability during digestion, thereby increasing the overall nutritional value of noodles., Competing Interests: Declaration of competing interest There are no conflicts of interest to declare. This article does not contain studies involving human or animal subjects., (Copyright © 2024 Elsevier B.V. All rights reserved.)
- Published
- 2024
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