101. Microstructure modification and mechanical reinforcement in sub-10 μm scale Cu/Sn–Ag/Cu microbump joints via Co-addition of Zn and Ni in Cu substrates.
- Author
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Lee, Yin-Ku, Wu, Zih-Yu, Huang, Ping-Wei, Tsai, Su-Yueh, Chang, Shou-Yi, and Duh, Jenq-Gong
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ELECTRON probe microanalysis , *SOLUTION strengthening , *INTERMETALLIC compounds , *COPPER , *SOLDER joints , *COPPER-tin alloys - Abstract
The trend towards miniaturization of solder joints addresses the need for high-density interconnections in microelectronics. Excessive intermetallic compounds (IMC) and phase transformations cause internal stresses, leading to voiding and cracking in conventional microbumps. Therefore, advanced microbump design must focus on IMC suppression and phase stabilization. This study explores Cu–26Zn–18Ni/Sn-3.5Ag/Cu–26Zn–18Ni microbumps, comparing them to conventional Cu/Sn-3.5Ag/Cu under various reflow times. High-field emission electron probe micro-analysis and transmission electron microscopy reveal improved microstructures. Electron backscatter diffraction confirms the (Cu,Ni) 6 (Sn,Zn) 5 grain size of several hundreds of nanometers. Fracture modes were established based on the correlation between shear testing and fracture surfaces. Cu–26Zn–18Ni/Sn-3.5Ag/Cu–26Zn–18Ni microbumps enhanced shear strength (19.6 %–97.8 %) and failure toughness (10.6 %–132.1 %) compared to Cu/Sn-3.5Ag/Cu. The solid solution strengthened and refined (Cu,Ni) 6 (Sn,Zn) 5 combined with tough bulk (Cu,Ag) 5 (Sn,Zn) 8 in Cu–26Zn–18Ni/Sn-3.5Ag/Cu–26Zn–18Ni microbumps, demonstrate a tough microstructure. These findings provide insights into the design of microbumps with a bonding height in sub-10micron scales. • The microstructure evolutions and phase identifications of Cu/Sn-3.5Ag/Cu and Cu–26Zn–18Ni/Sn-3.5Ag/Cu–26Zn–18Ni were investigated by EPMA and EBSD. • Complete inhibition of phase transformation to Cu 3 Sn and the formation of Kirkendall voids was achieved during reflow at 260 °C and isothermal aging at 150 °C in Zn/Ni-alloyed microbumps. • The grain size of Cu 6 Sn 5 was modified from several micrometers to hundreds of nanometers with highly random orientations by doping of Zn/Ni. • Mechanical reinforcement of Zn/Ni-alloyed microbumps was demonstrated and correlated with microstructures, grain structures, and fracture modes. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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