101. The reduced order model for creep using dynamic mode decomposition.
- Author
-
Wang, Yong and Jiang, Naibin
- Subjects
- *
MATERIAL plasticity , *MONOLITHIC reactors , *FINITE element method , *NUCLEAR engineering , *HIGH temperatures - Abstract
• This work introduces a reduced order model (ROM) of modeling thermal creep developed by dynamic mode decomposition (DMD). • The application of ROM allows for the rapid estimation of creep effects in complex structures, thereby improving the design efficiency. • The updated stress algorithm for the 316H unified visco-plastic constitutive equation in the 2023 edition ASME code are derived. Given the computational challenges associated with finite element methods in analyzing creep behavior in high-temperature components, this work presents an advanced method for modeling thermal creep in complex structures through a reduced order model (ROM) developed via dynamic mode decomposition (DMD). The results indicate that the ROM using DMD can predict long-term structural responses related to creep based on short-term data with high accuracy, enhancing significantly computational efficiency. The application of ROM allows for the rapid estimation of creep effects in complex structures, like monoliths in the MegaPower reactor, thereby improving the design efficiency. The eigenvalues of the creep related ROM all fall in the unit circle on the complex plane, indicating that creep is a stable development process. The DMD with improved time mode coefficient can reconstruct strain-rate related plastic deformation and cyclic visco-plastic deformation process. Additionally, we derive the necessary stress updating algorithm and consistent tangent operator matrix for the 316H unified visco-plastic constitutive equation in 2023 edition ASME code, ensuring accurate modeling of material creep behavior under high temperatures in this paper. This work provides a valuable tool for the safe design and operation of critical components in nuclear engineering and other high-temperature applications. [ABSTRACT FROM AUTHOR]
- Published
- 2024
- Full Text
- View/download PDF