101. Electrochemical corrosion behaviour of Bi–11Ag alloy for electronic packaging applications
- Author
-
Chi-Hang Tsai, Jenn-Ming Song, and Yen-Pei Fu
- Subjects
Materials science ,Passivation ,General Chemical Engineering ,Alloy ,Analytical chemistry ,General Chemistry ,engineering.material ,Electron spectroscopy ,Corrosion ,Chemical engineering ,X-ray photoelectron spectroscopy ,Phase (matter) ,X-ray crystallography ,engineering ,General Materials Science ,Polarization (electrochemistry) - Abstract
This study investigated the electrochemical corrosion properties of the solders for die-attach applications in 3.5% NaCl solution. Compared with Pb–5Sn and Zn–40Sn, Bi–11Ag exhibited higher corrosion potential and relatively low corrosion current density. The ductile Ag-rich phase which dispersed in the Bi matrix was able to accommodate the stress arising from the formation of a passive layer and contributed to the two-stage passivation. X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) results confirm that the corrosion products comprised BiOCl, Bi 2 O 3 and AgCl.
- Published
- 2010