101. A non-galvanic D-band MMIC-to-waveguide transition using eWLB packaging technology
- Author
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Hassona, A., He, Z. S., Mariotti, C., Dielacher, F., Vassilev, V., Li, Y., Oberhammer, Joachim, Zirath, H., Hassona, A., He, Z. S., Mariotti, C., Dielacher, F., Vassilev, V., Li, Y., Oberhammer, Joachim, and Zirath, H.
- Abstract
This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Level Ball Grid Array (eWLB) commercial process. The non-galvanic transition is realized through a slot antenna directly radiating to a standard air filled waveguide. The interconnect achieves low insertion loss and relatively wide bandwidth. The measured average insertion loss is 3 dB across a bandwidth of 22% covering the frequency range 110138 GHz. The measured average return loss is -10 dB across the same frequency range. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz. This solution enables mm-wave system on chip (SoC) to be manufactured and assembled in high volumes cost effectively. To the authors' knowledge, this is first attempt to fabricate a packaging solution beyond 100 GHz using eWLB technology., QC 20171116
- Published
- 2017
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