101. Mechanical characterization of FDM components made of polyaryletherketone (PAEK) for aerospace applications: a comparison of direct printing and box-cut sample manufacturing strategies.
- Author
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Scipioni, Silvia Ilaria, Pace, Francesco, Paoletti, Alfonso, and Lambiase, Francesco
- Subjects
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TENSILE tests , *YOUNG'S modulus , *TENSILE strength , *AEROSPACE engineering , *AEROSPACE engineers , *FUSED deposition modeling - Abstract
This study delves into the manufacturing strategies employed for fabricating tensile samples utilized in the mechanical characterization of material extrusion (MEX) components constructed with polyaryletherketone (PAEK) for aerospace applications. Two distinct methods were investigated for obtaining tensile test samples: direct cutting and extraction from a box. These methods were examined under both as-printed and annealing conditions. Quasistatic tensile tests were conducted along the building direction to evaluate the impact of processing conditions on the adhesion of overlying layers. The results unveiled significant disparities in mechanical behavior and crystallinity between directly printed samples and those derived from the box. The Young's modulus exhibited marginal influence; however, the tensile strength of directly printed samples measured at 30 MPa (prior to annealing), corresponding to 50% of the strength observed in samples cut from the box (60 MPa). Moreover, the elongation at rupture of directly printed samples was found to be less than 2%, while that of cut samples exceeded 8%. Notably, directly printed samples exhibited a significant degree of incipient crystallization (12.18%), contrasting with the lower level of crystallinity observed in samples cut from the box (3.27%). These findings underscore the importance of recognizing the limitations associated with direct sample printing, emphasizing its crucial role in accurately characterizing components destined for the aerospace industry. Furthermore, this understanding is pivotal for optimizing the performance and reliability of MEX-printed PAEK components in aerospace engineering applications. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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