101. Deposición y caracterización de películas delgadas de W depositadas mediante evaporación térmica.
- Author
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Ipaz, Leonid, Arias, Nicole, Moreno, Gijana, David Copete-Viatela, Juan, and David Ipaz-Sabogal, Juan
- Subjects
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ATOMIC force microscopy , *SCANNING electron microscopy , *THIN films , *CRYSTAL structure , *TUNGSTEN , *CHEMICAL stability , *MORPHOLOGY - Abstract
Tungsten (W) has been of great importance in the industry due to its chemical stability and mechanical properties, which have allowed W to be used in a wide range of applications. However, in the literature most of the research reports focus on the interaction of tungsten with other elements, forming alloys in compounds such as W2C and WC. Tungsten (W) in the form of a film and without alloys is not presented in the literature, so this research work focused on the study of the structural and morphological nature of W films deposited on to glass and silicon (100) substrates by thermo-resistive evaporation at different current values. The structural nature of the layers is studied using X-Ray Diffraction (XRD) identifying the characteristic reflections of the crystalline structure of W in the (110), (200), and (211) planes, where it was found that there is no influence of the current applied to the crystalline structure of the layers. The morphological characteristics of the layers were studied using Atomic Force Microscopy (AFM), finding a direct relationship between the applied current and the values of roughness and grain size, the thickness of the layers varied between 210 and 260 nm. Using scanning electron microscopy, the high densification of the deposited layers will be verified. This research managed to demonstrate the possibility of depositing thin films using the thermo-resistive evaporation technique in which the structural nature of the block material is preserved. These type of films, according to the literature consulted, could be used in the manufacture of interconnections in microprocessors (Lee et al., 2019). [ABSTRACT FROM AUTHOR]
- Published
- 2023
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