101. Thermal Warpage of Czochralski Silicon Wafers Grown under a Nitrogen Ambience
- Author
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Deren Yang, Huanming Lu, Duanlin Que, Liben Li, and Zhizhen Ye
- Subjects
Materials science ,Argon ,Silicon ,Annealing (metallurgy) ,Metallurgy ,chemistry.chemical_element ,Mineralogy ,Condensed Matter Physics ,Nitrogen ,Electronic, Optical and Magnetic Materials ,Oxygen precipitation ,chemistry ,Mechanical strength ,Thermal ,Wafer - Abstract
The thermal warpage of nitrogen-doped Czochralski (NCZ) silicon wafers affected by preannealing was investigated. After preannealing at 1000 °C for 6 h, the warpage of the NCZ silicon wafers was suppressed during subsequently thermal warping tests, while the silicon wafers grown under an argon ambient (ACZ) showed an increase in warpage. Nitrogen was considered to be very effective to increase the mechanical strength of silicon wafers because of the formation of nitrogen-oxygen clusters with smaller sizes. After preannealing at 1000 °C for 16 h, both ACZ and NCZ silicon wafers showed a large increase of warpage due to the large amount of oxygen precipitation.
- Published
- 1998
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