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102. SIP and 3-D Interconnects.

Author

Matihias, Thorsten, Pargfrieder, Stefan, Wimplinger, Markus, and Lindner, Paul

Subjects
*ELECTRONIC packaging, *MANUFACTURING processes, *ELECTRONIC systems, *ELECTRONIC industries, *PRODUCTION engineering
Abstract

The article provides information on the significance of systems-in-a-package (SiP) and three-dimensional interconnects towards electronic packaging applications. It has been sought that SiPs and three-dimensional interconnects offer better performance because of the reduced interconnect length and power consumption, smaller form factor as well as the higher device density. The two methodologies offers a wide range of applications requiring a variety of different manufacturing processes.

Published
2006

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