726 results on '"Kim, Joungho"'
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102. A Frequency-Selective EMI Reduction Method for Tightly Coupled Wireless Power Transfer Systems Using Resonant Frequency Control of a Shielding Coil in Smartphone Application
103. Design and Analysis of High-Definition Multimedia Interface Connectors considering Signal Integrity
104. Fast and Accurate Deep Neural Network (DNN) Model Extension Method for Signal Integrity (SI) Applications
105. Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis
106. Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System
107. Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity
108. Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip
109. Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box
110. Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs
111. A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias
112. Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System
113. A Dual Resonance Near Field Communication Coil for EMF Reduction in Near Field Communication and Wireless Power Transfer Dual Coil System
114. Analytical Expressions of Differential-mode Harmonics in Loosely-coupled Series-resonant Wireless Power Transfer System
115. Eye Diagram Prediction for Input/output Buffer Information Specification-Algorithmic Modeling Interface (IBIS-AMI)
116. Electrical Performance Comparison between Coaxial and Non-coaxial Silicone Rubber Socket
117. Design and Analysis of An Active Simultaneously Switching Output Noise Reduction Scheme
118. Modeling and Analysis of Multiple Coupled Through-Silicon Vias (TSVs) for 2.5-D/3-D ICs
119. High Efficiency Wireless Power Transfer System using a Two-stack Hybrid Metamaterial Slab
120. Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substate for Flexible Wearable Devices
121. Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System
122. Design Methodology of Passive Equalizer for GDDR6 Memory Test
123. Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material
124. Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications
125. Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC
126. Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via
127. Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC
128. Modeling of Through-silicon Via (TSV) with an Embedded High-density Metal-insulator-metal (MIM) Capacitor
129. High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test
130. Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) Systems
131. Noise Coupling Analysis from High Voltage Capacitor Discharging Circuit in an Electronic Safety and Arming Device
132. Reinforcement Learning-Based Optimal on-Board Decoupling Capacitor Design Method
133. A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels
134. Eye-Width and Eye-Height Estimation Method Based on Artificial Neural Network (ANN) for USB 3.0
135. Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network
136. Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module
137. Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface
138. EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field
139. Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems
140. Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s
141. Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils
142. Design, Simulation and Measurement of Flexible PCB Coils for Wearable Device Wireless Power Transfer
143. Design and Analysis of EMI Shielding Method using Intermediate Coil for Train WPT System
144. Core-Shared-Repeater (CSR) Coil Scheme for Low EMI and Efficient WPT System in Ultra-Thin Digital TV
145. Bias-dependent power distribution network impedance analysis with MOS capacitor
146. Eye-diagram estimation with stochastic model for 8B/10B encoded high-speed channel
147. A Study on the High Frequency Performance of Solder ACFs Joints for Flex-on-Board Applications Using Coplanar Waveguide
148. Estimation and analysis of crosstalk effects in high-bandwidth memory channel
149. Statistical eye-diagram estimation method for high-speed channel with N-tap decision feedback equalizer (DFE)
150. Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System
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