327 results on '"Kang, S.K."'
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102. 278EFFECT OF GLYCOSAMINOGLYCAN SUPPLEMENT ON PORCINE PREIMPLANTATION EMBRYO DEVELOPMENT AND EXPRESSION OF RECEPTORS FOR GLYCOSAMINOGLYCANS IN PORCINE EMBRYOS
103. Treacherous cape awaits Azhar (200)
104. Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders.
105. Annealing effect on the optical properties in Si delta-doped Al0.24Ga0.76As/In0.15Ga0.85As/GaAs pseudomorphic high electron mobility transistor structures
106. A case of acute renal failure, rhabdomyolysis and disseminated intravascular coagulation associated with scrub typhus
107. A case of giant condylomata acuminata involving anus after renal transplantation
108. A comparative study of the optical characteristics of commonly used sinoscopes: do you know where you are looking?
109. Effects of peripheral benzodiazepine receptor ligands on proliferation and differentiation of human mesenchymal stem cells
110. Baculovirus Expression Vectors that Incorporate the Foreign Protein into Viral Occlusion Bodies
111. Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders.
112. A Highly Reliable FRAM (Ferroelectric Random Access Memory).
113. Key Integration Technologies for Nanoscale FRAMs.
114. Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification Process.
115. Overexpression of extracellular superoxide dismutase protects mice from radiation-induced lung injury
116. Occurrence of angiosarcoma and gastric adenocarcinoma following a cutaneous CD30-positive anaplastic large cell lymphoma
117. Manufacturing Technologies for a Highly Reliable, 0.34 μm2-Cell, 64 Mb, and 1T1C FRAM.
118. Video Object Tracking Based On Extended Active Shape Models With Color Information
119. Effect of Intermetallics Spalling on the Mechanical Behavior of Electroless Ni(P)/Pb-Free Solder Interconnection.
120. Quality assured mass productive 1.6V operational 0.18 /spl mu/m 1T1C FRAM embedded smart card with advanced integration technologies against defectives.
121. Spalling behaviors of intermetallic compounds during the wetting reaction of Sn(3.5Ag) on electroless Ni-P metallization.
122. Fully logic compatible (1.6V Vcc, 2 additional FRAM masks) highly reliable sub 10F2 embedded FRAM with advanced direct via technology and robust 100 nm thick MOCVD PZT technology.
123. Formation of AgSn plates in Sn-Ag-Cu alloys and optimization of their alloy composition.
124. Effect of brain‐derived neurotrophic factor in neural differentiation of mouse embryonic stem cells and neural precursor cells
125. Development of conductive adhesive materials for via fill applications
126. Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates.
127. Interfacial reaction studies on lead (Pb)-free solder alloys.
128. Development of conductive adhesive materials for via fill applications.
129. Equivalent circuit model and its application for slit discontinuity in CPW structure.
130. The effects of long-term glycemic control on serum lipoprotein(a) levels in patients with type 2 diabetes mellitus
131. Prostaglandin F2α Activates Mitogen-Activated Protein Kinase in Human Granulosa-Luteal Cells
132. Endocrine Influences on Normal and Neoplastic Ovarian Surface Epithelium (OSE) Cell Growth
133. Acute urinary toxicity following transperineal prostate brachytherapy
134. Supersymmetric neutrino masses and mixing with R-parity violation
135. Freezing injury to persimmons (Diospyros kaki Thunb.) and four other Diopyros species during deacclimation in the spring as related to bud development
136. Development of high conductivity lead (Pb)-free conducting adhesives
137. Exothermic Characteristics of Dormant Buds of Persimmon (Diospyros kaki Thunb.) in Relation to Cold Hardiness
138. Growth and p-type doping of GaN on c-plane sapphire by nitrogen plasma-assisted molecular beam epitaxy
139. A CAD approach to helical groove machining. Part 2: Numerical evaluation and sensitivity analysis
140. Charactererization of novel non-toxic Bacillus thuringiensis isoloates from Korea
141. A CAD approach to helical groove machining—I. mathematical model and model solution
142. Expression and Synergistic Effect of Three Types of Crystal Protein Genes in Bacillus thuringiensis
143. A Comparative Study of Platelets Stored in Polyvinyl Chloride Containers Plasticised with Butyryl Trihexyl Citrate or Triethylhexyl Trimellitate
144. Functional Analysis of Hepatitis B Virus Transactivator X: Implication of the Leucine Zipper-like Region and C-Terminal Seven Conserved Amino Acids in Functional Regions
145. Gold-to-aluminum bonding for TAB applications
146. Sensitivity Analysis and Tolerance Allocation for Microplanar Drill Point Grinders
147. Gold-to-aluminum bonding for TAB applications.
148. Development of high conductivity lead (Pb)-free conducting adhesives.
149. Interfacial reactions with lead (Pb)-free solders.
150. Orientation Characteristics with Process Parameters of PLZT(X /70/100) Thin Films Prepared by RF-Magnetron Sputtering.
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