101. Impulse Pressuring Diffusion Bonding of TiC Cermet to Stainless Steel Using Ti/Nb Interlayer
- Author
-
LI Jia, SHENG Guang-min, and HUANG Li
- Subjects
tic cermet ,diffusion bonding ,impulse pressuring ,ti/nb ,microstructure ,Materials of engineering and construction. Mechanics of materials ,TA401-492 - Abstract
Impulse pressuring diffusion bonding(IPDB) and constant pressuring diffusion bonding(CPDB) of TiC cermet to 304 stainless steel(304SS) using Ti/Nb interlayer was carried out at 890℃ under a impulse pressuring of 2-10MPa and a constant pressuring of 10MPa within a duration of only 4-12min, and a robust metallurgical bonding was achieved. Microstructure characterization and shear performance of the IPDB and CPDB joints were analyzed by SEM, EDS, XRD and shearing test. The results show that the interface phases in those two kinds of joints are similar, which are mainly σ phase,(β-Ti, Nb) and α+β-Ti solid solution. When the joint is bonded for 10min, shear strength of TiC/304SS CPDB joints is 55.6MPa, while the shear strength of IPDB joints reaches 110MPa. The fracture of CPDB joints is TiC cermet fracture, while that of IPDB joints is mixed fracture by alternated between TiC cermet and reaction layer.
- Published
- 2017
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