101. Evaluation of Thin-Film Residual Stress Using Nano-Indentation Combined with an Atomic Force Microscope
- Author
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Dongil Kwon, Yun-Hee Lee, and Jae-il Jang
- Subjects
Stress (mechanics) ,Materials science ,Deformation (mechanics) ,Residual stress ,Indentation ,Statistical and Nonlinear Physics ,sense organs ,Composite material ,Nanoindentation ,Condensed Matter Physics ,Curvature ,Contact area ,Stress intensity factor - Abstract
Thin-film stress changes the shape of nanoindentation loading curve. The change in the indentation load is treated as the effect of the residual stress on the indenting deformation. A residual-stress-induced normal load is defined as a multiple of contact area and plastic deformation-sensitive deviator stress component extracted from the equi-biaxial thin-film stress. A final equation for the residual stress is derived from the residual-stress-induced normal load by considering an integration along a depth-controlled stress-relaxation route. This proposed model is applied to the analyses of the nanoindentation curves for diamond-like carbon thin films. The residual stresses from the nanoindentation analyses were consistent with the values obtained by the conventional curvature method.
- Published
- 2003