343 results on '"Wunderle, B."'
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52. Characterization of EMC/LF interfacial fracture toughness using the advanced mixed-mode bending method
53. Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
54. Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
55. Non-destructive in-situ monitoring of delamination of buried interfaces by a thermal pixel (Thixel) chip
56. Robust design optimization: On methodology and short review
57. Characterization of epoxy based highly filled die attach materials in microelectronics
58. Rapid testing method for interface crack analysis of an adhesive bonded joint using an electrodynamic shaker
59. Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
60. In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package
61. Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling
62. High cycle fatigue testing and modelling of sputtered aluminium thin films on vibrating silicon MEMS cantilevers
63. Stress investigations in 3D-integrated silicon microstructures
64. Advances and challenges of experimental reliability investigations for lifetime modelling of sintered silver based interconnections
65. Raman based stress analysis of the active areas of a piezoresistive MEMS force sensor — Experimental setup, data processing, and comparison to numerically obtained results
66. IR pulse thermography as failure analytical tool applied to die attach processes
67. Thermo — Mechanical characterization and reliability modelling of sintered silver based thermal interface materials
68. "LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials
69. Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
70. A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement
71. Challenges in the reliability of 3D integration using TSVs
72. Acceleration of lifetime modeling by isothermal bending fatigue tests
73. Advances in percolated thermal underfill (PTU) simulations for 3D-integration
74. Flip chips on PCB - from single chip encapsulation to systems in package
75. Non-destructive failure analysis and modelling of encapsulated miniature SMD ceramic chip capacitors using thermal and mechanical loading
76. Reliablility of SnPb and Pb-Free Flip-Chips under Different Test Conditions
77. RoHS after July 2006
78. Zuverlässigkeit von Lötverbindungen
79. 3D-PCB-packaging technology for high power applications with water cooling
80. Thermal characterization of highly conductive die attach materials
81. Phase change based thermal buffering of transient loads for power converter
82. Measurements of the mechanical stress induced in flip chip dies by the underfill and simulation of the underlying phenomena of thermal-mechanical and chemical reactions
83. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization — Difficulties and solution
84. Feasibility and design study of a frictionless air mover for thermal management of electronics
85. Stress impact of moisture diffusion measured with the stress chip
86. Efficiency optimization for a frictionless air flow blade fan - Design study
87. Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC
88. Double-sided cooling and transient thermo-electrical management of Silicon on DCB assemblies for power converter modules: Design, technology and test
89. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip
90. Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC
91. Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
92. Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
93. Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test
94. Stress impact of thermal-mechanical loads measured with the stress chip
95. Transient thermal techniques as failure analytical tool
96. Transient cooling of power electronic devices using thermoelectric coolers coupled with phase change materials
97. Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization
98. Transport of moisture at epoxy–SiO2 interfaces investigated by molecular modeling
99. Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
100. Piezoresistive force sensor and thermal actuators usage as applications to nanosystems manipulation: Design, simulations, technology and experiments
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