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51. Intracellular and extracellular components as bacterial thermometers, and early warning against thermal stress

53. On the scaling of thermal stresses in passivated nanointerconnects

54. Fatigue crack propagation properties of welded joints at 300[degrees]C

55. Changes in the fluorescence of the Caribbean coral Montastraea faveolata during heat-induced bleaching

56. Interlaminar stress analysis of shell structures with piezoelectric patch including thermal loading

57. Plane thermal stress analysis of an orthotropic cylinder subjected to an arbitrary, transient, asymmetric temperature distribution

58. Single-event cracking temperature of asphalt pavements directly from bending beam rheometer data

59. A cracked piezoelectric material strip under transient thermal loading

60. Exact solution for thermoelastic deformations of functionally graded thick rectangular plates

61. First-order-theory-based thermoelastic stability of functionally graded material circular plates

62. Thermal stresses in functionally graded beams

63. The thermal constant for timing the emergence of the Red Palm Weevil, Rhynchophorus ferrugineus (Oliv.) (Coleoptera, Curculionidae)

64. Thermostressed State of a Hollow Glass Cylinder under the Action of Electromagnetic Radiation

65. Study of the Thermostressed State of a Piecewise-Homogeneous Friction Assembly

66. DESIGN AND ANALYSIS SYSTEM FOR THERMAL CRACKING IN ASPHALT CONCRETE

68. Analysis of average thermal stresses in passivated metal interconnects

69. Relaxation of thermal stresses in double-coated optical fibers

70. General model for mechanical stress evolution during electromigration

71. Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy

72. Three-dimensional versus two-dimensional finite element modeling of flip-chip packages

74. Elastic-plastic stress field in a coated continuous fibrous composite subjected to thermomechanical loading

75. On thermal stress in a bituminous pavement: analytic solutions and applications

76. Coupled liquid and vapor flow in miniature passages with micro grooves

77. Damage mechanics of surface mount technology solder joints under concurrent thermal and dynamic loading

78. Heterothermal acclimation: an experimental paradigm for studying the control of thermal acclimation in crabs

79. Thermoelastic distortion of EHD line contacts during the passage of soft debris particles

80. Thermal stresses in hermetically double-coated optical fibers

81. Residual capacity of HSC thermally damaged deep beams

82. Green's function for a heat source in an infinite region with an arbitrary shaped hole

83. Thermal and mechanical stress in induction coilguns

84. Structural optimization with thermal and mechanical constraints

85. Analysis of composite panels subjected to thermo-mechanical loads

86. Thermal stresses from large volumetric expansion during freezing of biomaterials

87. Transitions between Aulacoseira and Anabaena dominance in a turbid river weir pool

88. Arctic field test offers method for estimating pipeline heave

89. Linear fracture mechanics analysis on growth of interfacial delamination in LSI plastic packages under temperature cyclic loading

90. Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging

91. Thermal stress development during vacuum arc remelting and permanent mold casting of ingots

92. Effect of interphase layers on thermal stresses within an elliptical inclusion

93. Prediction of extent of heat affected zone in laser grooving of unidirectional fiber-reinforced plastics

94. The Cosserat Spectrum theory in thermoelasticity and application to the problem of heat flow past a rigid spherical inclusion

95. Effects of thermomechanical coupling and relaxation times on wave spectrum in dynamic theory of generalized thermoelasticity

96. Mechanisms for total dose sensitivity to preirradiation thermal stress in bipolar linear microcircuits

97. Thermal stresses in a freezing sphere and its application to cryobiology

98. Elastodynamic solution for the thermal shock stresses in an orthotropic thick cylindrical shell

99. Thermal stresses in a generally anisotropic body with an elliptic inclusion subject to uniform heat flow

100. Thermomechanical models for leadless solder interconnections in flip chip assemblies

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