51. On the accuracy of reduced-order integrated circuit simulators for computing the heat production on electronic components
- Author
-
Tarek I. Zohdi and B. Emek Abali
- Subjects
Computer science ,Nodal analysis ,Spice ,Hardware_PERFORMANCEANDRELIABILITY ,02 engineering and technology ,Integrated circuit ,01 natural sciences ,law.invention ,Computer Science::Hardware Architecture ,law ,0103 physical sciences ,Hardware_INTEGRATEDCIRCUITS ,Electronic engineering ,Electrical and Electronic Engineering ,010302 applied physics ,Dissipation ,021001 nanoscience & nanotechnology ,Atomic and Molecular Physics, and Optics ,Finite element method ,Electronic, Optical and Magnetic Materials ,Modeling and Simulation ,visual_art ,Electronic component ,visual_art.visual_art_medium ,Transient (oscillation) ,Resistor ,0210 nano-technology - Abstract
A modern circuit board consists of several thousand interacting electronic components. Reduced-order models are often used to rapidly simulate such systems for design purposes, which require the testing of large numbers of design configurations. Reduced-order simulators, such as SPICE, are often used, which are based on a lumped mass nodal analysis. While the intended use of such models is for rigid and isothermal systems, they are also used in order to acquire the temperature evolution in integrated circuits (IC) by computing the dissipation produced in components such as transistors. Generally, reduced-order circuit simulators are not as accurate as a detailed, computationally expensive, direct finite element method (FEM) simulation of an electromagnetic system. In this paper, we determine the inaccuracies introduced in a reduced-order model by simulating the same system by means of a detailed three-dimensional, coupled, and nonlinear FEM analysis for electromagneto-thermomechanical fields. Specifically, we compare results from a one-dimensional SPICE simulation to the three-dimensional transient FEM computation. Using SPICE, we calculate the electric potential with the known resistance providing Joule heating of a resistor on an IC. In an FEM computation, we solve coupled governing equations for electromagnetic potentials, determine electric current distribution, and integrate over the continuum body in order to calculate the dissipated power. We find out that there is an up to 30% of discrepancy between computations from SPICE and FEM in terms of the dissipation. After an intensive study explained in this manuscript, we obtain the root cause of the aforementioned significant difference between SPICE and FEM. The geometrical simplification from three-dimensional continuum to a one-dimensional model brings in an inadequate assumption on the boundary conditions. This assumption generates a significant error in the determined power from SPICE in the case of a resistor, concretely a standard micro-metal electrode leadless face (MELF) studied herein.
- Published
- 2018