204 results on '"Stress sensors"'
Search Results
52. Lanthanide mechanoluminescence
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Jean-Claude G. Bünzli and Ka-Leung Wong
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02 engineering and technology ,General Chemistry ,Stress sensors ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Pressure sensors ,Geochemistry and Petrology ,Rare earths ,Mechanoluminescence ,Impact sensors ,0210 nano-technology ,Triboluminescence - Abstract
Mechanoluminescence (ML) is the emission of light consecutive to a mechanical force or stress imposed to a crystalline material. Many inorganic and organic compounds present this phenomenon that is known for over 400 years. Lanthanide and uranyl salts were among the first substances investigated for this property. Mechanoluminescence, also referred to as triboluminescence, is often considered as being a badly understood phenomenon. In fact it is because of two main reasons. Firstly, a variety of different mechanical stresses, from simple rubbing, to applied pressure, crushing, impact of a weight, ultrasound, laser-generated shock wave, crystallization, dissolution of crystals, or even wind can trigger it. Secondly, ML is very sensitive to the purity and morphology of the sample: in inorganic compounds, generation of traps by doping "impurities" (e.g. lanthanide ions) is responsible for light emission so that the exact composition of the sample has to be known to a very detailed level; for chelates, the crystallization conditions are crucial since they often generate extended networks of weak interactions that are instrumental in triggering ML when they are broken. In fact mechanisms of ML are relatively well known and theories and models often reproduce very well the experiments. Additionally, practical applications are at hand, for example stress, crack, and impact sensors based on SrAl2O4: Eu-II or Et3NH[Eu(dbm)(4)] are used to test structures and materials as diverse as road bridges, reinforced concrete elements, pressurized containers or airplane wings and to image the propagation of cracks or stress distribution. Military and security applications involve detecting the passage of vehicle or soldiers and producing counterfeiting inks while more joyful applications are luminous balls, wrapping papers and adhesive tapes. Not only bulk materials, but micro- and nanoparticles feature mechanoluminescent properties and single particle manipulation under an AFM allows one to produce light sources that could be useful to several photonic applications, including bio-applications. The review starts with a short historical background of ML, discussing definitions, and providing some theoretical bases. It then presents instrumental setups before covering all aspects of lanthanide mechanoluminescence, starting with simple salts, then doped inorganic compounds (irradiated and non-irradiated) and finally chelates. Mechanoluminescent sensors are described with various actual and potential applications. Literature is covered until April 2017. The wealth of information gathered during the past 20 years in the field and the broad understanding of the phenomenon attained show that the field is presently ready for a quantitative leap forward. Many subjects are waiting to be developed, including NIR mechanoluminescence or bio-applications based on single mechanoluminescent particle light sources; in addition, designing new types of mechanoluminescent materials with techniques paralleling the developments in other aspects of lanthanide photonics could prove extremely rewarding. (C) 2018 Chinese Society of Rare Earths. Published by Elsevier B.V. All rights reserved.
- Published
- 2018
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53. Regenerated Silk Fibroin-Modified Soft Graphene Aerogels for Supercapacitive Stress Sensors
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Hongmei Guo, Pengfei Fang, Linsheng Huang, Wei Zeng, Ning Wei, Xu Chao, Xiaohui Guo, Jizhu Fu, Chang Long, and Yi Xiong
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Materials science ,Renewable Energy, Sustainability and the Environment ,Graphene ,law ,Stress sensors ,Materials Chemistry ,Electrochemistry ,Fibroin ,Nanotechnology ,Condensed Matter Physics ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,law.invention - Abstract
The regenerated silk fibroin is developed to soft graphene aerogels for application in stress sensor. The resultant graphene aerogel owns a low density of 14.1 mg cm−3 with high mass specific capacitance of 128.4 F g−1. When a single aerogel serving as elastic medium, a supercapacitive stress sensor is established to offer high sensitivity of 0.73 kPa−1 in ranging 0.01–10 kPa. In contract, the sensor based on original graphene aerogel just shows a sensitivity of 0.04 kPa−1. Further, the sensing stability of the optimized sensor can retain 87% under constant pressure intensity of 1 kPa for 1000 cycles. The soft effect can be attributed to the regenerated silk fibroin by intercalation in preparation, and the simulated results show that the stress response originated from the variation of ion concentration in the electrochemical system.
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- 2021
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54. Objective measures, sensors and computational techniques for stress recognition and classification: A survey
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Sharma, Nandita and Gedeon, Tom
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PHYSIOLOGICAL stress , *COMPUTATIONAL biology , *HEALTH surveys , *NOSOLOGY , *DETECTORS , *ARTIFICIAL neural networks - Abstract
Abstract: Stress is a major growing concern in our day and age adversely impacting both individuals and society. Stress research has a wide range of benefits from improving personal operations, learning, and increasing work productivity to benefiting society – making it an interesting and socially beneficial area of research. This survey reviews sensors that have been used to measure stress and investigates techniques for modelling stress. It discusses non-invasive and unobtrusive sensors for measuring computed stress, a term we coin in the paper. Sensors that do not impede everyday activities that could be used by those who would like to monitor stress levels on a regular basis (e.g. vehicle drivers, patients with illnesses linked to stress) is the focus of the discussion. Computational techniques have the capacity to determine optimal sensor fusion and automate data analysis for stress recognition and classification. Several computational techniques have been developed to model stress based on techniques such as Bayesian networks, artificial neural networks, and support vector machines, which this survey investigates. The survey concludes with a summary and provides possible directions for further computational stress research. [Copyright &y& Elsevier]
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- 2012
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55. The Role of Central Nervous System Development in Late-Onset Neurodegenerative Disorders.
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Palubinsky, Amy M., Martin, Jacob A., and McLaughlin, BethAnn
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The human brain is dependent upon successfully maintaining ionic, energetic and redox homeostasis within exceptionally narrow margins for proper function. The ability of neurons to adapt to genetic and environmental perturbations and evoke a 'new normal' can be most fully appreciated in the context of neurological disorders in which clinical impairments do not manifest until late in life, although dysfunctional proteins are expressed early in development. We now know that proteins controlling ATP generation, mitochondrial stability, and the redox environment are associated with neurological disorders such as Parkinson's disease and amyotrophic lateral sclerosis. Generally, focus is placed on the role that early or long-term environmental stress has in altering the survival of cells targeted by genetic dysfunctions; however, the central nervous system undergoes several periods of intense stress during normal maturation. One of the most profound periods of stress occurs when 50% of neurons are removed via programmed cell death. Unfortunately, we have virtually no understanding of how these events proceed in individuals who harbor mutations that are lethal later in life. Moreover, there is a profound lack of information on circuit formation, cell fate during development and neurochemical compensation In either humans or the animals used to model neurodegenerative diseases. In this review, we consider the current knowledge of how energetic and oxidative stress signaling differs between neurons in early versus late stages of life, the influence of a new group of proteins that can integrate cell stress signals at the mitochondrial level, and the growing body of evidence that suggests early development should be considered a critical period for the genesis of chronic neurodegenerative diseases. [ABSTRACT FROM AUTHOR]
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- 2012
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56. Protein degradation and the stress response
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Flick, Karin and Kaiser, Peter
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PROTEOLYSIS , *PHYSIOLOGICAL stress , *EUKARYOTES , *PROTEASOMES , *UBIQUITIN ligases , *TISSUE physiology - Abstract
Abstract: Environmental stresses are manifold and so are the responses they elicit. This is particularly true for higher eukaryotes where various tissues and cell types are differentially affected by the insult. Type and scope of the stress response can therefore differ greatly among cell types. Given the importance of the ubiquitin proteasome system (UPS) for most cellular processes, it comes as no surprise that the UPR plays a pivotal role in counteracting the effects of stressors. Here we outline contributions of the UPS to stress sensing, signaling, and response pathways. We make no claim to comprehensiveness but choose selected examples to illustrate concepts and mechanisms by which protein modification with ubiquitin and proteasomal degradation of key regulators ensures cellular integrity during stress situations. [Copyright &y& Elsevier]
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- 2012
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57. Suitable materials for elastico mechanoluminescence-based stress sensors
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Chandra, V.K. and Chandra, B.P.
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LUMINESCENCE spectroscopy , *ELASTICITY , *CRYSTAL optics , *STRAINS & stresses (Mechanics) , *PIEZOELECTRICITY , *EXCITED state chemistry , *NONLINEAR optics , *RELAXATION phenomena - Abstract
Abstract: Whereas the elastico mechanoluminescence (EML) of certain crystals increases linearly with the stress, nonlinearity occurs in the EML intensity versus stress plot of several crystals. The EML of crystals can be understood on the basis of piezoelectrically-induced detrapping model, whereby the localized piezoelectric field causes detrapping of electrons or holes and subsequently the capture of electrons in the excited states of activator ions, recombination of electrons in hole captured centres, recombination of holes in electron-captured centres or simply the electron–hole recombination gives rise to the light emission. Considering the piezoelectrically-induced detrapping model of EML expression is derived for the stress dependence of the EML intensity. It is shown that the crystals having uniform distribution of traps show linear relationship between the EML intensity and stress and the crystals having exponential distribution of traps show nonlinear relationship between the EML intensity and stress. The crystals having linear dependence of EML intensity on stress are suitable for the fabrication of EML-based stress sensors. The values of coefficient of deformation detrapping, relaxation time of the crosshead of the machine used to deform the samples and lifetime of the charge carriers in the shallow traps lying in the normal piezoelectric region of the crystals can be determined from the EML measurements. The values of the coefficient of deformation detrapping are 0.310, 0.018 and 0.021MPa−1 for SrMgAl6O11:Eu, Sr2MgSi2O7:Eu and SrCaMgSi2O7:Eu crystals, respectively. The coefficient of deformation detrapping is low for SrAl2O4:Eu, SrAl2O4:Eu, Dy, SrBaMgSi2O7:Eu and ZnS:Mn crystals and such crystals are suitable for EML-based stress sensors. A good agreement is found between the theoretical and experimental results. [Copyright &y& Elsevier]
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- 2011
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58. AlGaN/GaN C-HEMT structures for dynamic stress detection.
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Vanko, Gabriel, Držík, Milan, Vallo, Martin, Lalinský, Tibor, Kutiš, Vladimír, Stančík, Stanislav, Rýger, Ivan, and Kostič, Ivan
- Abstract
Abstract: In our work, we investigated the possibility of dynamic stress detection based on the piezoelectric polarization using AlGaN/GaN based Circular High Electron Mobility Transistors (C-HEMTs). In our knowledge, stress sensors in that account are introduced for the first time. The sensor structures exhibit good linearity in the piezoelectric response under dynamic stress conditions. The measurements reveal excellent stress detection sensitivity that is independent on the measured frequency range. The sensitivity of the devices can be easily increased by increase of the area of the Schottky gate ring electrode. [ABSTRACT FROM AUTHOR]
- Published
- 2010
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59. Abiotic Stress in Plants; Stress Perception to Molecular Response and Role of Biotechnological Tools in Stress Resistance
- Author
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Noreen Falak, Bong-Gyu Mun, Qari Muhammad Imran, Byung-Wook Yun, and Adil Hussain
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Drought stress ,Salinity ,stress sensors ,Biology ,Heat stress ,salinity ,heat stress ,Cultivar ,Abiotic component ,Resistance (ecology) ,business.industry ,Abiotic stress ,drought stress ,fungi ,Biochemistry and Molecular Biology ,CRISPR-cas9 ,food and beverages ,Agriculture ,Stress sensors ,Stress resistance ,Stress perception ,Biotechnology ,Molecular Response ,cold stress ,business ,Cold stress ,Agronomy and Crop Science ,Biokemi och molekylärbiologi - Abstract
Plants, due to their sessile nature, face several environmental adversities. Abiotic stresses such as heat, cold, drought, heavy metals, and salinity are serious threats to plant production and yield. To cope with these stresses, plants have developed sophisticated mechanisms to avoid or resist stress conditions. A proper response to abiotic stress depends primarily on how plants perceive the stress signal, which in turn leads to initiation of signaling cascades and induction of resistance genes. New biotechnological tools such as RNA-seq and CRISPR-cas9 are quite useful in identifying target genes on a global scale, manipulating these genes to achieve tolerance, and helping breeders to develop stress-tolerant cultivars. In this review, we will briefly discuss the adverse effects of key abiotic stresses such as cold, heat, drought, and salinity. We will also discuss how plants sense various stresses and the importance of biotechnological tools in the development of stress-tolerant cultivars.
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- 2021
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60. Design, Fabrication, and Calibration of a Piezoresistive Stress Sensor on SOT Wafers for Electronic Packaging Applications.
- Author
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Kuo Tian, Zheyao Wang, Min Zhang, and Litian Liu
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SILICON-on-insulator technology , *ELECTRONIC packaging , *DETECTORS , *CALIBRATION , *DIELECTRICS , *CONFIGURATION space - Abstract
This paper presents the development of a piezoresistive stress sensor fabricated on silicon-on-insulator (SOI) wafers for measurement of electronic packaging stress at high temperature. The sensor consists of a series of sensor elements and calibration elements. The sensor elements comprise a 0°-90° p-type piezoresistor pair and a ±45° n-type piezoresistor pair for stress measurement, and the calibration elements comprise two polar three-piezoresistor rosettes with specific angels to calibrate the piezoresistive coefficients. The sensor and the calibration piezoresistors are etched from the SO! layer as separate "silicon islands" on the dielectric buried oxide (BOX) layer. This configuration exploits the excellent electrical insulation of the BOX layer, and enables high-temperature operation of the stress sensor by eliminating the leakage current. Design, fabrication, and the calibration of the piezoresistors at high temperatures show the feasibility of the SOI high-temperature stress sensor. The piezoresistive coefficients are calibrated versus stress and temperature, and the nonlinearity of the resistance versus temperature and the calibration errors are discussed in detail. [ABSTRACT FROM AUTHOR]
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- 2009
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61. Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From -150,^\circ C to +125,^\circ C.
- Author
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Chun-Hyung Cho, Jaeger, R.C., and Suhling, J.C.
- Abstract
Stress sensing test chips are widely utilized to investigate integrated circuit die stresses arising from assembly and packaging operations. In order to utilize these test chips to measure stresses over a wide range of temperatures, one must have values of six piezoresistive coefficients for n- and p-type silicon over the temperature range of interest. However, the literature provides limited data over the desired range, and even the data at room temperature exhibit wide discrepancies in magnitude as well as sign. Thus, this work focuses on an extensive experimental study of the temperature dependence of the fundamental piezoresistive coefficients, pi11, pi12, and pi44, for both p- and n-type silicon from -150degC to +125degC, as well as a number of useful combined coefficients. Measurements were performed using stress sensors fabricated on (001) silicon. In order to minimize errors associated with misalignment with the crystallographic axes on (001) silicon wafers, anisotropic wet etching was used to accurately locate the axes. Four-point bending (4PB) was used to generate the required stress in strip-on-beam samples, and finite-element simulations were used to determine the states of stress in the silicon material. [ABSTRACT FROM PUBLISHER]
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- 2008
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62. Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing.
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Chun-Hyung Cho, Jaeger, R.C., Suhling, J.C., Yanling Kang, and Mian, A.
- Abstract
Piezoresistive stress sensors on the (111) surface of silicon offer the unique ability to measure the complete stress state at a point in the (111) material. However, four-point bending or wafer-level calibration methods can measure only four of the six piezoresistive coefficients for p- and n-type resistors required for application of these sensors. In this work, a hydrostatic test method has been developed in which a high-capacity pressure vessel is used to apply a triaxial load to a single die over the -25degC to+100 degC temperature range. The slopes of the adjusted resistance change versus pressure plots yield pressure coefficients for p- and n-type silicon that provide the additional information necessary to fully determine the complete set of piezoresistive coefficients. [ABSTRACT FROM PUBLISHER]
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- 2008
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63. Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics
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Benjamin Leever
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Engineering ,business.industry ,Stress sensors ,General partnership ,Automotive Engineering ,Electronics manufacturing ,Wireless ,Electronics ,business ,Manufacturing engineering - Abstract
As the electronics in our daily lives proliferate, they continue to be largely limited to rigid form factors with bulky packaging dictated by traditional electronics manufacturing processes and fragile components. Yet for applications ranging from wireless, low-profile medical devices to smart food labels to aircraft with embedded stress sensors, there's a need for high-performance electronics that conform to the shape of our bodies, vehicles, and consumer goods. Flexible Hybrid Electronics (FHE), which combine additive manufacturing processes with flexible silicon will enable these capabilities. To move these concepts from the lab to the manufacturing floor in the United States, the Department of Defense established NextFlex, America's Flexible Hybrid Electronics Manufacturing Institute in 2015. Based in San Jose, CA, NextFlex is a $170M public-private partnership that is building a domestic FHE manufacturing ecosystem by developing manufacturing processes and tools with its member companies and universities, standing up an FHE manufacturing pilot line in Silicon Valley, and establishing education and workforce development programs to train tomorrow's workforce. This presentation will focus on the FHE opportunity, the NextFlex FHE manufacturing roadmaps, and NextFlex projects in areas such as device integration & packaging, modeling & design tools, and printed flexible components.
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- 2017
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64. Visualized bond scission in mechanically activated polymers
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Yulan Chen and Yuan Yuan
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chemistry.chemical_classification ,Toughness ,Materials science ,Polymers and Plastics ,Stress sensors ,General Chemical Engineering ,Bond ,Organic Chemistry ,Nanotechnology ,02 engineering and technology ,Polymer ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,chemistry ,Chromism ,Covalent bond ,Mechanochemistry ,0210 nano-technology ,Bond cleavage - Abstract
Visualization and quantitative evaluation of covalent bond scission in polymeric materials are critical in understanding their failure mechanisms and improving the toughness and reliability of the materials. Mechano-responsive polymers with the ability of molecular-level transduction of force into chromism and luminescence have evoked major interest and experienced significant progress. In the current review, we highlight the recent achievements in covalent mechanochromic and mechanoluminescent polymers, leading to a bridge between macroscopic mechanical properties and microscopic bond scission events. After a general introduction concerning polymer mechanochemistry, various examples that illustrate the strategies of design and incorporation of functional and weak covalent bonds in polymers were presented, the mechanisms underlying the optical phenomenon were introduced and their potential applications as stress sensors were discussed. This review concludes with a comment on the opportunities and challenges of the field.
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- 2017
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65. Geometry optimization for planar piezoresistive stress sensors based on the pseudo-Hall effect
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Doelle, M., Mager, D., Ruther, P., and Paul, O.
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DETECTORS , *WHEATSTONE bridge , *COMPLEMENTARY metal oxide semiconductors , *FINITE element method - Abstract
Abstract: The dependence of the sensitivity of planar piezoresistive stress sensors on geometry is systematically analyzed. The sensors in this paper are based on the shear piezoresistance effect, also termed pseudo-Hall effect. The analyzed geometry parameters are: (i) the shape of the device active area, (ii) its aspect ratio and (iii) the location and size of input and output contacts. Further, the influence of non-conducting islands in the active device area was investigated. General design rules for the design of piezoresistive stress sensors with improved sensitivity were extracted. These results were obtained using a simulation approach combining affine mapping with the finite element method. The simulation program was tested by comparing simulation results with experimental data obtained from stress sensors fabricated in CMOS technology. The differences between simulated and measured results were between 1.2 and 3.3%. Novel optimized sensor geometries with non-conducting islands show simulated and measured sensitivities greatly improved by factors up to 2.30 and 2.39, respectively. Further, the new sensors with non-conducting islands are put in perspective with classical Wheatstone bridges. [Copyright &y& Elsevier]
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- 2006
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66. Sources of Variation in Piezoresistive Stress Sensor Measurements.
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Slattery, Orla, O'mahoney, Denis, Sheehan, Eoin, and Waidron, Finbarr
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DETECTORS , *SEMICONDUCTOR industry , *CALIBRATION , *PHYSICAL measurements , *STANDARDIZATION , *ELECTRIC measurements - Abstract
Piezoresistive stress sensors are widely used to characterize semiconductor die stresses. Packaging stresses induce a small change in resistance in the sensors and they are highly sensitive to factors such as temperature and processing conditions. Thus, accurate stress prediction requires calibration and knowledge of all sources of variation in the resistance response of the sensors. This paper quantifies the effect of process variations and demonstrates that die level tractability is critical to ensure accurate stress prediction. [ABSTRACT FROM AUTHOR]
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- 2004
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67. Nrf2, stress and aging
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Ioannis P. Trougakos
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Aging ,stress sensors ,NF-E2-Related Factor 2 ,Longevity ,Bioinformatics ,Models, Biological ,Insulin/IGF-like ,Nrf2 ,Stress (mechanics) ,03 medical and health sciences ,Stress, Physiological ,Medicine ,Animals ,Humans ,030304 developmental biology ,0303 health sciences ,mitostasis ,proteostasis ,Stress sensors ,business.industry ,030302 biochemistry & molecular biology ,Cell Biology ,Proteostasis ,Editorial ,Drosophila ,business ,metabolism ,Signal Transduction - Published
- 2019
68. Influence of the porosity of PDMS foams on the performances of flexible capacitive stress sensors
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Sylvie Bilent, Emile Martincic, Pierre-Yves Joubert, and Thi-Hong-Nhung Dinh
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Work (thermodynamics) ,Materials science ,Fabrication ,Stress sensors ,Capacitive sensing ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Shear stress ,Sensitivity (control systems) ,Composite material ,0210 nano-technology ,Porosity - Abstract
Centimetric capacitive sensors made out of PDMS foams of controlled porosity are fabricated and electromechanically characterized under either normal stress and shear stress. For normal stress characterizations, it can be concluded that the density of the foam strongly affects the sensor performances expressed in sensitivity and measurement range thanks to dedicated behavioral sensor models. Also, it was found that the actual size of the foam pores plays a minor role in the electromechanical behavior of the sensor. Similar conclusions can be derived shear stress sensor characterizations. This work opens the way to the design of flexible sensors with adjustable performances for normal and shear stress measurements.
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- 2019
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69. Information processing by endoplasmic reticulum stress sensors
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Wylie Stroberg, Justin Eilertsen, and Santiago Schnell
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0301 basic medicine ,Cell signaling ,Biomedical Engineering ,Biophysics ,Bioengineering ,Endoplasmic Reticulum ,Models, Biological ,Biochemistry ,Biomaterials ,03 medical and health sciences ,0302 clinical medicine ,Animals ,Humans ,030304 developmental biology ,0303 health sciences ,Stress sensors ,Chemistry ,Mechanism (biology) ,Endoplasmic reticulum ,Endoplasmic Reticulum Stress ,Cell biology ,Folding (chemistry) ,030104 developmental biology ,Foldase ,Unfolded Protein Response ,Unfolded protein response ,Protein folding ,Life Sciences–Mathematics interface ,030217 neurology & neurosurgery ,Homeostasis ,Signal Transduction ,Biotechnology - Abstract
The unfolded protein response (UPR) is a collection of cellular feedback mechanisms that seek to maintain protein folding homeostasis in the endoplasmic reticulum (ER). When the ER is “stressed”, either through high protein folding demand or undersupply of chaperones and foldases, stress sensing proteins in the ER membrane initiate the UPR. Recently, experiments have indicated that these signaling molecules detect stress by being both sequestered by free chaperones and activated by free unfolded proteins. However, it remains unclear what advantage this bidirectional sensor control offers stressed cells. Here, we show that combining positive regulation of sensor activity by unfolded proteins with negative regulation by chaperones allows the sensor to make a more informative measurement of ER stress. The increase in the information capacity of the combined sensing mechanism stems from stretching of the active range of the sensor, at the cost of increased uncertainty due to the integration of multiple signals. These results provide a possible rationale for the evolution of the observed stress sensing mechanism.
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- 2019
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70. Three-Dimensional Graphene Composite Containing Graphene-SiO2 Nanoballs and Its Potential Application in Stress Sensors
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Xi Zhou, Xiaoxia Li, Zhao Bowei, Kai Zhou, Xiangzhi Liu, Tai Sun, Dapeng Wei, and Lianhe Dong
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Materials science ,Graphene ,Stress sensors ,General Chemical Engineering ,Composite number ,graphene ,Oxide ,Nanotechnology ,Chemical vapor deposition ,stress sensor ,Hydrothermal circulation ,Nanomaterials ,law.invention ,three-dimensional structure ,lcsh:Chemistry ,chemistry.chemical_compound ,chemistry ,lcsh:QD1-999 ,Electrical resistivity and conductivity ,law ,General Materials Science - Abstract
Combining functional nanomaterials composite with three-dimensional graphene (3DG) is a promising strategy for improving the properties of stress sensors. However, it is difficult to realize stress sensors with both a wide measurement range and a high sensitivity. In this paper, graphene-SiO2 balls (GSB) were composed into 3DG in order to solve this problem. In detail, the GSB were prepared by chemical vapor deposition (CVD) method, and then were dispersed with graphene oxide (GO) solution to synthesize GSB-combined 3DG composite foam (GSBF) through one-step hydrothermal reduction self-assembly method. The prepared GSBF owes excellent mechanical (95% recoverable strain) and electrical conductivity (0.458 S/cm). Furthermore, it exhibits a broad sensing range (0&ndash, 10 kPa) and ultrahigh sensitivity (0.14 kPa&minus, 1). In addition, the water droplet experiment demonstrates that GSBF is a competitive candidate of high-performance materials for stress sensors.
- Published
- 2019
71. The Principle and Architectures of Optical Stress Sensors and the Progress on the Development of Microbend Optical Sensors
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Wen J. Li, Vellaisamy A. L. Roy, Weijia Wang, and Humphrey H. P. Yiu
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Stress (mechanics) ,Materials science ,Stress sensors ,Pressure sensing ,Mechanical engineering ,Atomic and Molecular Physics, and Optics ,Electronic, Optical and Magnetic Materials - Published
- 2021
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72. Recent advances in mechanoluminescent polymers
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Yulan Chen, Yuan Yuan, and Wei Yuan
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chemistry.chemical_classification ,Materials science ,Stress sensor ,Stress sensors ,Nanotechnology ,02 engineering and technology ,Polymer ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Molecular level ,chemistry ,General Materials Science ,0210 nano-technology ,Mechanoluminescence - Abstract
In recent years, mechanoluminescence from polymers is emerging as a new cutting-edge area of polymer mechanochemistry research. It refers to the release of energy from polymers in the form of light when they are under various mechanical stimuli. To spur more researchers to join in such interesting and new burgeoning area, and promote its development to practical applications, in this review, we try to briefly summarize the recent advances in mechanoluminescent polymers with the aspects of non-covalent, covalent, and cascade reactions systems. We pay much attention on the applications of such polymer systems in molecular level failure and stress sensors, and give a perspective of their potential applications in novel energy conversion materials and devices, as well as self-healing materials.
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- 2016
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73. Development of new technologies for the THz domain with applications on structural health monitoring
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Pavia, João Pedro Calado Barradas Branco, Ribeiro, Marco Alexandre dos Santos, and Souto, Nuno Manuel Branco
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terahertz ,Equipamento de saúde ,Radiação ,Sistemas de segurança ,Informática aplicada à saúde ,Filters ,Engenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e Informática [Domínio/Área Científica] ,Frequency selective surfaces ,Stress sensors ,Sstructural health monitoring ,Processador de sinais ,Sensor - Abstract
Structural health monitoring (SHM) plays a major role in industry and engineering today, as this methodology has completely changed the paradigm of how to assess the health status of structures. Previously, the methodology of reference, Non-Destructive Testing (NDT), consisted on conducting periodic inspections, made by specialized professionals that used external equipment. However, this method was quite expensive and time consuming. SHM systems are considered as an alternative to traditional methods, since these systems allow the continuous acquisition of the structural responses from the disturbances experienced by the structure. Through the measurement data, it will be possible to know the health condition of the structure and the existence of structural damages. Sensors represent a fundamental component of these systems, since they are responsible for the acquisition of data related to the health and integrity of the structures and they should be accessible, light and discrete, so as not to impose cost and weight on the structure and not to interfere with the structural resistance. Although the THz domain is a relatively new field of research in electromagnetic sensors, it is known that the use of frequency selective surfaces (FSSs) allows the creation of compact devices which can be easily integrated into the surface of the structures without harming its functionality and aesthetic appearance. The main goal of this dissertation is to study and numerically simulate stress sensors for the detection of THz radiation for applications in SHM, with high sensitivity and selectivity. Taylloring these characteristics to provide a good detection has been achieved through appropriate selection of materials and careful design of stress tunnable band pass filters for the THz domain. Numerical modelling of both the mechanical and electromagnetics, solving the elasticity equation and Maxwell’s equations, respectively, has been undertaken for two types of assembling of the devices using different thermoplastic polymers such as high-density polyethylene (HDPE) and polytetrafluoroethylene (PTFE). It was observed that two methodologies can be adopted to control the level of force applied to the sensors, namely through, the variation of the electric current and the positioning of the coil on the plunger. A monitorização de saúde estrutural (SHM) desempenha um papel bastante importante na indústria e na engenharia hoje em dia, uma vez que esta metodologia mudou completamente o paradigma de como aferir o estado de saude das estruturas. Anteriormente, a metodologia de referência consistia em realizar inspeções periódicas com recurso a equipamentos externos, as quais eram realizadas por profissionais especializados. Contudo, este método revelou ser bastante dispendioso e moroso. Os sistemas SHM são considerados uma alternativa aos métodos tradicionais, uma vez que esses sistemas permitem a aquisição contínua das respostas estruturais provenientes das perturbações experimentadas pela estrutura e saber qual o estado de saúde da estrutura com base nas medições efectuadas. Os sensores são base destes sistemas, devendo ser acessíveis, leves e discretos, para não impor custo e peso à estrutura e não interferir na resistência estrutural. Apesar da vasta gama de sensores disponíveis, existe alguma carência de sensores altamente selectivos para o domínio dos Terahertz. Embora o domínio THz seja um campo relativamente novo de investigação em sensores eletromagnéticos, sabe-se que o uso de superfícies seletivas de frequência (FSSs) permite a criação de dispositivos compactos que podem ser facilmente integrados na superfície das estruturas sem prejudicar sua funcionalidade e aspecto estético. O objetivo principal desta dissertação é estudar e simular numericamente sensores de stress para a detecção de radiação THz para aplicações em SHM, com alta sensibilidade e seletividade. A determinação dessas características para fornecer uma boa detecção foi conseguida através da seleção apropriada de materiais e do design cuidadoso de filtros passa-banda sintonizáveis por tensão para o domínio dos THz. Foram realizadas simulações numéricas das componentes mecânica e electromagnética dos sensores com objectivo de resolver a equação de elasticidade e as equações de Maxwell respectivamente, para dois tipos de montagem dos dispositivos, utilizando diferentes polímeros termoplásticos, tais como polietileno de alta densidade (HDPE) e politetrafluoretileno (PTFE). Observou-se que podem ser adotadas duas metodologias para controlar o nível de força aplicado aos sensores, tais como a variação da corrente elétrica e o posicionamento da bobina no êmbolo.
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- 2018
74. Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide
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Jun Chen, Leonid Fursin, Richard C. Jaeger, and Jeffrey C. Suhling
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Stress (mechanics) ,chemistry.chemical_compound ,Resistive touchscreen ,Materials science ,Silicon ,chemistry ,Stress sensors ,Calibration ,Silicon carbide ,chemistry.chemical_element ,Composite material - Abstract
Stress sensors have shown potential to provide “health monitoring” of a wide range of issues related to packaging of integrated circuits, and silicon carbide offers the advantage of much higher temperature sensor operation with application in packaged high-voltage, high-power SiC devices as well as both automotive and aerospace systems, geothermal plants, and deep well drilling, to name a few. This paper discusses the theory and uniaxial calibration of resistive stress sensors on 4H silicon carbide (4H-SiC) and provides new theoretical descriptions for four-element resistor rosettes and van der Pauw (VDP) stress sensors. The results delineate the similarities and differences relative to those on (100) silicon: resistors on the silicon face of 4H-SiC respond to only four of the six components of the stress state; a four-element rosette design exists for measuring the in-plane stress components; two stress quantities can be measured in a temperature compensated manner. In contrast to silicon, only one combined coefficient is required for temperature compensated stress measurements. Calibration results from a single VDP device can be used to calculate the basic lateral and transverse piezoresistance coefficients for 4H-SiC material. Experimental results are presented for lateral and transverse piezoresistive coefficients for van der Pauw structures and p- and n-type resistors. The VDP devices exhibit the expected 3.16 times higher stress sensitivity than standard resistor rosettes.
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- 2018
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75. Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture
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Jun Chen, Jeffrey C. Suhling, and Richard C. Jaeger
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Conjecture ,Materials science ,Stress sensors ,010401 analytical chemistry ,Mathematical analysis ,Diagonal ,Mode (statistics) ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Computer Science Applications ,Electronic, Optical and Magnetic Materials ,Stress (mechanics) ,Van der Pauw method ,Mechanics of Materials ,Electrical and Electronic Engineering ,0210 nano-technology - Abstract
The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136(4), p. 041014; Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2018, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 140(1), p. 017001] was backed up by measurements and simulation results, but not mathematically proven. A proof based upon two-port impedance parameter reciprocity is presented with additional experimental confirmation.
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- 2018
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76. Erratum: 'Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors' [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333]
- Author
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Mohammad Motalab, Safina Hussain, Richard C. Jaeger, and Jeffrey C. Suhling
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010302 applied physics ,Physics ,Silicon ,Stress sensors ,Mathematical analysis ,chemistry.chemical_element ,02 engineering and technology ,Electron ,021001 nanoscience & nanotechnology ,01 natural sciences ,Computer Science Applications ,Electronic, Optical and Magnetic Materials ,Van der Pauw method ,chemistry ,Mechanics of Materials ,Reciprocity (electromagnetism) ,0103 physical sciences ,Electrical and Electronic Engineering ,0210 nano-technology ,Electrical impedance - Abstract
The conjecture discussed in the referenced paper was backed up by measurements and simulation results, but not mathematically proven. A proof based on impedance parameter reciprocity is presented, and a sign error is corrected.
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- 2018
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77. Piezotronic Effect in a Zinc Oxide Nanowire
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Rusen Yang and Ren Zhu
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Materials science ,business.industry ,Stress sensors ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,Piezoresistive effect ,0104 chemical sciences ,Electrical resistivity and conductivity ,Zinc oxide nanowire ,Electrode ,Optoelectronics ,Charge carrier ,0210 nano-technology ,business - Abstract
In previous chapters, we discussed the material preparation for the piezotronic strain/stress sensors. This chapter focuses on the sensing mechanism. Different types of strain/stress sensors have been invented for not only conventional applications but also emerging fields like artificial skin [114] and human-machine interface [115]. In spite of the large number of designs, the fundamental mechanisms enabling those sensors fall into only a few categories. One major category is based on the phenomenon that a mechanical strain can affect the charge carrier transport in a homogeneous material with two electrodes. Altering of the transport characteristics can come from the geometric change, the piezoresistive effect that is related to the material resistivity [116], and the piezotronic effect that is related to the interfacial barrier between the material and the electrode [10, 17].
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- 2018
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78. Functionalization of carbon fiber tows with ZnO nanorods for stress sensor integration in smart composite materials
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Maurizio Culiolo, Davide Delmonte, Andrea Zappettini, Tae Yun Kim, Marco Villani, Sang-Woo Kim, Massimo Solzi, L. Marchini, and Davide Calestani
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Nanostructure ,Materials science ,stress sensors ,Bioengineering ,02 engineering and technology ,Smart material ,01 natural sciences ,0103 physical sciences ,carbon fibers ,General Materials Science ,Texture (crystalline) ,Electrical and Electronic Engineering ,Composite material ,010302 applied physics ,Stress sensor ,piezoelectricity ,Mechanical Engineering ,General Chemistry ,Epoxy ,021001 nanoscience & nanotechnology ,Piezoelectricity ,Mechanics of Materials ,visual_art ,smart materials ,visual_art.visual_art_medium ,ZnO ,Surface modification ,Nanorod ,0210 nano-technology - Abstract
The physical and operating principle of a stress sensor, based on two crossing carbon fibers functionalized with ZnO nanorod-shaped nanostructures, was recently demonstrated. The functionalization process has been here extended to tows made of one thousand fibers, like those commonly used in industrial processing, to prove the idea that the same working principle can be exploited in the creation of smart sensing carbon fiber composites. A stress-sensing device made of two functionalized tows, fixed with epoxy resin and crossing like in a typical carbon fiber texture, was successfully tested. Piezoelectric properties of single nanorods, as well as those of the test device, were measured and discussed.
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- 2018
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79. Mechanoluminescence Rebrightening the Prospects of Stress Sensing: A Review.
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Zhuang Y and Xie RJ
- Abstract
The emergence of new applications, such as in artificial intelligence, the internet of things, and biotechnology, has driven the evolution of stress sensing technology. For these emerging applications, stretchability, remoteness, stress distribution, a multimodal nature, and biocompatibility are important performance characteristics of stress sensors. Mechanoluminescence (ML)-based stress sensing has attracted widespread attention because of its characteristics of remoteness and having a distributed response to mechanical stimuli as well as its great potential for stretchability, biocompatibility, and self-powering. In the past few decades, great progress has been made in the discovery of ML materials, analysis of mechanisms, design of devices, and exploration of applications. One can find that with this progress, the focus of ML research has shifted from the phenomenon in the earliest stage to materials and recently toward devices. At the present stage, while showing great prospects for advanced stress sensing applications, ML-based sensing still faces major challenges in material optimization, device design, and system integration., (© 2021 Wiley-VCH GmbH.)
- Published
- 2021
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80. Unfolded protein response in plants: one master, many questions
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Federica Brandizzi, Sang Jin Kim, Giovanni Stefano, and Cristina Ruberti
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Regulation of gene expression ,endocrine system ,Stress sensors ,Endoplasmic reticulum ,fungi ,food and beverages ,Plant Science ,Computational biology ,Biology ,Endoplasmic Reticulum Stress ,Bioinformatics ,digestive system ,Plant Physiological Phenomena ,Article ,Fight-or-flight response ,Gene Expression Regulation, Plant ,biological sciences ,Unfolded Protein Response ,Unfolded protein response ,Signal transduction ,Transcription factor - Abstract
To overcome endoplasmic reticulum (ER) stress, ER-localized stress sensors actuate distinct downstream organelle-nucleus signaling pathways to invoke a cytoprotective response, known as the unfolded protein response (UPR). Compared to yeast and metazoans, plant UPR studies are more recent but nevertheless fascinating. Here we discuss recent discoveries in plant UPR, highlight conserved and unique features of the plant UPR as well as critical yet-open questions whose answers will likely make significant contributions to the understanding plant ER stress management.
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- 2015
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81. The interferon regulatory factors as novel potential targets in the treatment of cardiovascular diseases
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Hongliang Li, Ding-Sheng Jiang, and Xiao-Jing Zhang
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Pharmacology ,Immune system ,Stress sensors ,Immunology ,Computational biology ,Biology ,Transcription factor ,Interferon regulatory factors - Abstract
The family of interferon regulatory factors (IRFs) consists of nine members (IRF1-IRF9) in mammals. They act as transcription factors for the interferons and thus exert essential regulatory functions in the immune system and in oncogenesis. Recent clinical and experimental studies have identified critically important roles of the IRFs in cardiovascular diseases, arising from their participation in divergent and overlapping molecular programmes beyond the immune response. Here we review the current knowledge of the regulatory effects and mechanisms of IRFs on the immune system. The role of IRFs and their potential molecular mechanisms as novel stress sensors and mediators of cardiovascular diseases are highlighted.
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- 2015
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82. Magnetoimpedance and Field Sensitivity of CoFeSiB Amorphous Ribbons under Applied Tensile Stress
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Seyed Majid Mohseni, Ali Dadsetan, Mehrdad Moradi, and Ali Jazayeri Gharehbagh
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Materials science ,Nuclear magnetic resonance ,Field (physics) ,Stress sensors ,Tension (geology) ,Giant magnetoimpedance ,Composite material ,Condensed Matter Physics ,Anisotropy ,Sensitivity (electronics) ,Electronic, Optical and Magnetic Materials ,Amorphous solid - Abstract
Magnetoimpedance (MI) and field sensitivity of CoFeSiB amorphous ribbons were investigated at frequencies ranging from 0.2 to 12 MHz after tensile stress applied. Experimental results indicate that the MI of amorphous ribbons can be significantly improved by applying a suitable longitudinal tensile stress. Applying tensile stress induces a rearrangement of domain walls which influences the circumferential anisotropy and magnetic permeability result in improving the MI response. The maximum MI response of 145 % and maximum field sensitivity of 6.32 %/Oe at frequency of 4 MHz were obtained, when tension was equivalent to 120 MPa. So the tensile stress as new method can be effective, cheap, and fast in sensor applications, and result of this investigation can be applied for the design of the stress sensors based on the giant magnetoimpedance effect.
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- 2015
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83. Conceptual design of magneto stress sensors
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K. K. Jurayeva and S. F. Amirov
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Microbiology (medical) ,Physics ,Conceptual design ,Stress sensors ,Immunology ,Electronic engineering ,Immunology and Allergy ,Mechanical engineering ,Sensitivity (control systems) ,Magneto - Published
- 2016
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84. A Combined Temperature and Stress Sensor in 0.18 μm CMOS Technology
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Samuel Francois, Samuel Huber, and Oliver Paul
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Work (thermodynamics) ,Engineering ,Resistive touchscreen ,Wheatstone bridge ,Stress sensor ,business.industry ,Stress sensors ,Cross sensitivity ,temperature sensor ,lcsh:A ,stress sensor ,law.invention ,CMOS ,law ,multisensor system ,Electronic engineering ,cross-sensitivity ,lcsh:General Works ,business - Abstract
This paper presents a solution for on-chip temperature and mechanical stress measurement in CMOS integrated circuits. Thereby both temperature and stress sensors are realized as resistive Wheatstone bridges. By design, both sensors show outputs affected by non-linearities and parasitic cross-sensitivities. The novelty presented in this work is to combine both non-ideal sensor outputs by applying a two-dimensional Newton-Raphson method to extract the actual values of temperature and mechanical stress which were obtained with errors of less than 0.5 K and 0.5 MPa.
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- 2017
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85. Research on the monitoring range of the embedded interface stress sensors for solid rocket motor
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Biao Ding, Kehai Dong, Yanhui Tang, and Bo Zhang
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Weapon system ,Stress (mechanics) ,Missile ,Computer science ,Stress sensors ,Shear stress ,Redundancy (engineering) ,Stress monitoring ,Solid-fuel rocket ,Automotive engineering - Abstract
For the construction of Shipbord solid rocket motor life cycle health management system based on embedded sensors the stress calculation of SRM interface under different loading conditions, the monitoring range of embedded interface stress sensors used for health management system was determined. As a result, it is found that the variation range of the solid motor's interface shear stress under the given shipboard condition is 0KPa-6KPa, The variation range of the solid motor's interface normal stress under the given alternating temperature loads is 0.05MPa-0.13MPa. Considering design redundancy, the stress monitoring process of the interface shear stress sensor and the normal stress sensor shall be not less than 10KPa and 1MPa. The research results can provide technical support for the development of life cycle management system of solid rocket motor, and have a great significance to improve the reliability of missile weapon system and life prediction.
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- 2017
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86. Effects of Defects on the Mechanical Properties of Kinked Silicon Nanowires
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Yunbo He, Liyi Li, Yun Chen, Xin Chen, Chia-Chi Tuan, Jian Gao, Ching-Ping Wong, and Cheng Zhang
- Subjects
Work (thermodynamics) ,Materials science ,Nano Express ,Stress sensors ,Nanowire ,Effects of defects ,Mechanical properties ,Nanotechnology ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,0104 chemical sciences ,Molecular dynamics ,Materials Science(all) ,Kinked silicon nanowires ,Molecular dynamics simulation ,General Materials Science ,Deformation (engineering) ,Composite material ,0210 nano-technology ,Silicon nanowires ,Elastic modulus - Abstract
Kinked silicon nanowires (KSiNWs) have many special properties that make them attractive for a number of applications. The mechanical properties of KSiNWs play important roles in the performance of sensors. In this work, the effects of defects on the mechanical properties of KSiNWs are studied using molecular dynamics simulations and indirectly validated by experiments. It is found that kinks are weak points in the nanowire (NW) because of inharmonious deformation, resulting in a smaller elastic modulus than that of straight NWs. In addition, surface defects have more significant effects on the mechanical properties of KSiNWs than internal defects. The effects of the width or the diameter of the defects are larger than those of the length of the defects. Overall, the elastic modulus of KSiNWs is not sensitive to defects; therefore, KSiNWs have a great potential as strain or stress sensors in special applications. Electronic supplementary material The online version of this article (doi:10.1186/s11671-017-1970-7) contains supplementary material, which is available to authorized users.
- Published
- 2017
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87. Modeling observer stress: A computational approach
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Tom Gedeon and Nandita Sharma
- Subjects
Engineering ,Artificial neural network ,Stress sensors ,business.industry ,Stress recognition ,Observer (special relativity) ,Machine learning ,computer.software_genre ,Human-Computer Interaction ,Fight-or-flight response ,Support vector machine ,Artificial Intelligence ,Encumbrance ,Computer Vision and Pattern Recognition ,Artificial intelligence ,business ,computer ,Software - Abstract
Stress is a major problem in our society today and poses major concerns for the future. It is important to gain an objective understanding of how average individuals respond to events they observe in typical environments they encounter. We developed a computational model of stress based on objective human responses collected from human observers of environments. In the process, we investigated whether a computational model can be developed to recognize observer stress in abstract virtual environments text, virtual environments films and real environments real-life settings using physiological and physical response sensor signals. Our work proposes an architecture for a computational observer stress model. The architecture was used it to implement models for the different types of environments. Sensors appropriate to the different types of environment were investigated where the aims were to achieve unobtrusive methods for stress response signal collection, reduce encumbrance and hence, enhance methods to capture natural observer behaviors and produce stress models that recognized stress more robustly. We discuss the motivations for each investigation and detail the experiments we conducted to collect stress data sets for observers of the different types of environments. We describe individual-independent artificial neural network and support vector machine based model classifiers that were developed to recognize stress patterns from observer response signals. The classifiers were extended to include a genetic algorithm which was used to select features that were better for stress recognition and reduce the use of redundant features. The outcomes of this research provide a possible future extension on managing stress objectively.
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- 2014
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88. Packaging Induced Die Stress Characterization Using van der Pauw Sensors Between −180°C and 80°C
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Michael C. Hamilton, Richard C. Jaeger, Uday S. Goteti, Francy John Akkara, and Jeffrey C. Suhling
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Materials science ,business.product_category ,Stress sensors ,Mechanical engineering ,Atmospheric temperature range ,Piezoresistive effect ,Characterization (materials science) ,Finite element simulation ,Stress (mechanics) ,Van der Pauw method ,Automotive Engineering ,Die (manufacturing) ,Composite material ,business - Abstract
Packaging-induced die-stresses due to temperature effects on various materials of the package are characterized using piezoresistive van der Pauw stress sensors over a temperature range of −180° C to 80° C. Piezo-resistive coefficients extracted previously are then used to obtain a mapping between change in resistance and corresponding stress at all tested temperatures. The obtained values of stress are compared with finite element simulation results.
- Published
- 2014
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89. Survey of the literature on mechanoluminescence from 1605 to 2013
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P. Jha and B. P. Chandra
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Inorganic salts ,Materials science ,Chemistry (miscellaneous) ,Stress sensors ,Biophysics ,Monitoring system ,Nanotechnology ,Literature survey ,Engineering physics ,Triboluminescence ,Mechanoluminescence - Abstract
Mechanoluminescence (ML) is a type of luminescence induced by any mechanical action on solids. The light emissions induced by elastic deformation, plastic deformation and fracture of solids are called elastico ML (EML), plastico ML (PML) and fracto ML (FML), respectively. Whereas nearly 50% of all organic molecular solids and inorganic salts exhibit FML, only a few solids exhibit EML and PML. The EML and FML of certain solids are so intense that they can be seen during daylight with the naked eye. Mechanolumnescence has a great potential for use in different types of mechano-optical devices such as stress sensors, damage sensors, impact sensors, fracture sensors and safety management monitoring systems. This article reports a survey of the literature from 1605 to 2013. Mechanoluminescence is studied by physicists, chemists, material scientists, geologists, medical scientists, engineers and technologists, among others and researchers will certainly benefit from the literature survey on ML given here. In addition, the field of mechanoluminescence may attract the interest of many new researchers.
- Published
- 2014
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90. Miniature Stress Test of Miniature Components Based on Piezoresistive Stress Sensors Test Circuit
- Author
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Xiaodong Wang, Yi Luo, and Yong Jian Qin
- Subjects
Materials science ,Adhesive bonding ,business.industry ,Stress sensors ,Mechanical Engineering ,Acoustics ,Design tool ,Structural engineering ,Piezoresistive effect ,Die (integrated circuit) ,Stress (mechanics) ,Mechanics of Materials ,Stress test ,General Materials Science ,business - Abstract
In this work, piezoresistive stress sensors test circuit fabricated into the sensitive structure as part of the normal processing procedure is used to measure the stresses difference distribution before and after the assembly. Sensor resistances were recorded before and after the adhesive bonding. Using the theoretical equations, the stresses on the die surface have been calculated from the data of sensor resistances. This technology not only provides a performance diagnostic tool for the sensitive structures and the miniature components, but also presents a design tool for low-stress micro-assemblies of miniature components.
- Published
- 2014
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91. Modeling a stress signal
- Author
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Nandita Sharma and Tom Gedeon
- Subjects
Support vector machine ,Artificial neural network ,Stress sensors ,business.industry ,Control theory ,Statistical analysis ,Artificial intelligence ,Observer (special relativity) ,business ,Hyperbolic tangent function ,Software ,Mathematics - Abstract
Stress is a major health problem in our world today. For this reason, it is important to gain an objective understanding of how average individuals respond to real-life events they observe in environments they encounter. Our aim is to estimate an objective stress signal for an observer of a real-world environment stimulated by meditation. A computational stress signal predictor system is proposed which was developed based on a support vector machine, genetic algorithm and an artificial neural network to predict the stress signal from a real-world data set. The data set comprised of physiological and physical sensor response signals for stress over the time of the meditation activity. A support vector machine based individual-independent classification model was developed to determine the overall shape of the stress signal and results suggested that it matched the curves formed by a linear function, a symmetric saturating linear function and a hyperbolic tangent function. Using this information of the shape of the stress signal, an artificial neural network based stress signal predictor was developed. Compared to the curves formed from a linear function, symmetric saturating linear function and hyperbolic tangent function, the stress signal produced by the stress signal predictor for the observers was the most similar to the curve formed by a hyperbolic tangent function with p
- Published
- 2014
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92. Gadd45 stress sensors in suppression of leukemia
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David L. Wiest
- Subjects
0301 basic medicine ,Gadd45 ,Stress sensors ,Biology ,medicine.disease ,Stress (mechanics) ,03 medical and health sciences ,Leukemia ,030104 developmental biology ,0302 clinical medicine ,Oncology ,030220 oncology & carcinogenesis ,Cancer research ,medicine - Published
- 2018
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93. Design of a Reconfigurable THz Filter Based on Metamaterial Wire Resonators with Applications on Sensor Devices.
- Author
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Pavia, João Pedro, Souto, Nuno, and Ribeiro, Marco Alexandre
- Subjects
TERAHERTZ materials ,MAXWELL equations ,FREQUENCY selective surfaces ,RESONATORS ,OPTICAL modulators ,FILTERS & filtration ,QUANTUM cascade lasers - Abstract
A study on the design, simulation and characterization of a reconfigurable terahertz (THz) filter, composed of two frequency-selective surfaces (FSSs) with applications on sensor devices in general and highly sensitive stress sensors, is presented in this paper. Using the developed theoretical model, we found out that by careful tuning the wire parameters, it is possible to control the filter sensitivity and also the energy transmission and reflection that passes through the structure. Numerical modelling of both the mechanical and electromagnetic components (using the elasticity equation and Maxwell's equations, respectively) has been undertaken for two types of the device assemblies based on different thermoplastic polymers transparent to the THz radiation, namely: high-density polyethylene (HDPE) and polytetrafluoroethylene (PTFE), operating in a THz window from 395 to 455 GHz. The numerical results allowed us to characterize the relation between the reflectance/transmittance and the amount of force required to obtain a specific frequency shift along that window. It was found that the device assembled with HDPE presents a more linear response and it is able to pass from a full transparency to almost full opacity using only its linear operating zone. Due to its characteristics, this THz filter might be an interesting solution not only for THz sensors based on reconfigurable filters but also for optical modulators for the THz domain. [ABSTRACT FROM AUTHOR]
- Published
- 2020
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94. In Vivo Monitoring of Orthopaedic Implant Wear Using Amorphous Ribbons
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Dia Eldean Giebaly, Samuel Bigot, Turgut Meydan, Peter Theobald, and David Okhiria
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Ultrahigh molecular weight polyethylene ,Materials science ,Stress sensors ,Bearing surface ,Implant failure ,sense organs ,Surgical implants ,Implant ,Electrical and Electronic Engineering ,Orthopaedic implant ,Electronic, Optical and Magnetic Materials ,Amorphous solid ,Biomedical engineering - Abstract
The wearing process of an ultrahigh molecular weight polyethylene (UHMWPE) bearing surface in orthopaedic surgical implants cannot be tracked at present; hence, implant failure only becomes apparent when the patient experiences some discomfort. In exploring the integration of wireless stress sensors into UHMWPE, this paper describes the first step in achieving in vivo monitoring of implant wear using magnetostrictive amorphous ribbons.
- Published
- 2015
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95. Field application of elasto-magnetic stress sensors for monitoring of cable tension force in cable-stayed bridges
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Jinsuk Yim, Chung Bang Yun, Jeong-Tae Kim, Sung Woo Shin, Ming L. Wang, Hyung-Jo Jung, and Seung-Hyun Eem
- Subjects
Engineering ,Field (physics) ,Stress sensors ,business.industry ,Work (physics) ,Structural engineering ,Cable tension ,Computer Science Applications ,law.invention ,Stress (mechanics) ,Control and Systems Engineering ,law ,Bridge (instrument) ,Cable stayed ,Structural health monitoring ,Electrical and Electronic Engineering ,business - Abstract
Recently, a novel stress sensor, which utilizes the elasto-magnetic (EM) effect of ferromagnetic materials, has been developed to measure stress in steel cables and wires. In this study, the effectiveness of this EM based stress sensors for monitoring of the cable tension force of a real scale cable-stayed bridge was investigated. Two EM stress sensors were installed on two selected multi-strand cables in Hwa-Myung Bridge, Busan, South Korea. Conventional lift-off test was conducted to obtain reference cable tension forces of two test cables. The reference forces were used to calibrate and validate cable tension force measurements from the EM sensors. Tension force variations of two test cables during the second tensioning work on Hwa-Myung Bridge were monitored using the EM sensors. Numerical simulations were conducted to compare and verify the monitoring results. Based on the results, the effectiveness of EM sensors for accurate field monitoring of the cable tension force of cable-stayed bridge is discussed.
- Published
- 2013
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96. Error analysis in stress measurement induced by the strain effects on (111) silicon
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Chun-Hyung Cho and Ho-Young Cha
- Subjects
Materials science ,Stress sensor ,Silicon ,Strain (chemistry) ,Stress sensors ,General Physics and Astronomy ,chemistry.chemical_element ,Stress measurement ,law.invention ,Stress (mechanics) ,chemistry ,law ,Error analysis ,Resistor ,Composite material - Abstract
We have fabricated p- and n-type resistor stress sensors on (111) silicon surface and investigated the strain effects, which were generally ignored in previous works, for the precise stress measurements. We obtained the corrected values of the pi-coefficients for p- and n-type silicon by considering the strain effects, without which more than 25% discrepancies may be induced for small pi-coefficients. We observed that ignoring the strain effects was one of the potential errors which induce large discrepancies in stress measurements, especially for n-type stress sensors on (111) silicon.
- Published
- 2013
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97. Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive
- Author
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Shujie Yang, Liyang Pan, Dong Wu, Zheyao Wang, and Xingjun Xue
- Subjects
Engineering drawing ,Fabrication ,Materials science ,Silicon ,business.industry ,Stress sensors ,010401 analytical chemistry ,chemistry.chemical_element ,Hardware_PERFORMANCEANDRELIABILITY ,02 engineering and technology ,021001 nanoscience & nanotechnology ,Chip ,01 natural sciences ,0104 chemical sciences ,Grinding ,Stress (mechanics) ,chemistry.chemical_compound ,chemistry ,Hardware_INTEGRATEDCIRCUITS ,Polypropylene carbonate ,Optoelectronics ,Adhesive ,0210 nano-technology ,business - Abstract
A technical challenge in fabrication of ultra-thin sensor chip (UTSC) is to keep chip integrity in debonding the ultra-thin chips from grinding facilities. This paper presents a new debonding method by utilizing a thermally decomposable polypropylene carbonate (PPC), as the temporary bonding adhesive. Because PPC can readily decompose at relatively low temperature, this method can maintain the chip integrity even the chips have a thickness of tens of microns. UTSCs with thickness of 30μm have been achieved using this method, and stress sensors have been developed to verify the performance of UTSC. The experimental results show that the proposed method is able to fabricate UTSC with good flexibility and characterizations, demonstrating the newly proposed method an enabling technology for fabrication of sensors for flexible and wearable applications.
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- 2016
- Full Text
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98. Stress direction and temperature detectable octagonal nMOSFET multi operation device
- Author
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Koyo Kaiwa and Tomochika Harada
- Subjects
010302 applied physics ,Materials science ,business.industry ,Stress sensors ,Electrical engineering ,Sense (electronics) ,01 natural sciences ,Measure (mathematics) ,Threshold voltage ,Stress (mechanics) ,Sensing data ,Dimension (vector space) ,0103 physical sciences ,MOSFET ,business - Abstract
In this paper, we design, fabricate, and evaluate octagonal nMOSFET multi operation device for normal MOSFET operation, detection of 8 stress direction, and variation of temperatures. In previous works, one sensor device can detect only one physical or chemical phenomenon. If we get some sensing data, such as temperature, stress, and etc., more than two sensor devices must be implemented. According to stress detection, stress sensors reattach along stress direction for measurement, because most of the previous stress sensors can sense only one dimension. However, octagonal MOSFET is not necessary to adjust because this device has radial eight direction output terminals and can accommodate various sensing using these terminals. Furthermore, this device can also measure the variation of threshold voltage using these output terminals. For example, proposed device can get variety of temperatures due to the temperature characteristics of threshold voltage. As the results, we can realize that it can sense 8 stress directions and a variety of temperature.
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- 2016
- Full Text
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99. Piezoresistive Membrane Surface Stress Sensors for Characterization of Breath Samples of Head and Neck Cancer Patients
- Author
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Frédéric Loizeau, Jean-Paul Rivals, Agnès Hiou, Hans Peter Lang, Pedro Romero, Terunobu Akiyama, Ernst Meyer, and Christoph Gerber
- Subjects
Male ,electronic nose ,Materials science ,Pilot Projects ,02 engineering and technology ,Biosensing Techniques ,lcsh:Chemical technology ,Biochemistry ,Article ,Analytical Chemistry ,03 medical and health sciences ,0302 clinical medicine ,piezoresistive membrane sensors ,medicine ,surface stress sensor ,nanomechanical sensor ,breath analysis ,head and neck cancer ,Humans ,In patient ,lcsh:TP1-1185 ,Electrical and Electronic Engineering ,Membrane surface ,Instrumentation ,Aged ,Aged, 80 and over ,Principal Component Analysis ,Electronic nose ,Stress sensors ,Head and neck cancer ,Middle Aged ,021001 nanoscience & nanotechnology ,medicine.disease ,Piezoresistive effect ,Atomic and Molecular Physics, and Optics ,Membrane ,Biosensing Techniques/methods ,Breath Tests ,Female ,Head and Neck Neoplasms/diagnosis ,Head and Neck Neoplasms/surgery ,Breath gas analysis ,Head and Neck Neoplasms ,030220 oncology & carcinogenesis ,0210 nano-technology ,Biomedical engineering - Abstract
For many diseases, where a particular organ is affected, chemical by-products can be found in the patient’s exhaled breath. Breath analysis is often done using gas chromatography and mass spectrometry, but interpretation of results is difficult and time-consuming. We performed characterization of patients’ exhaled breath samples by an electronic nose technique based on an array of nanomechanical membrane sensors. Each membrane is coated with a different thin polymer layer. By pumping the exhaled breath into a measurement chamber, volatile organic compounds present in patients’ breath diffuse into the polymer layers and deform the membranes by changes in surface stress. The bending of the membranes is measured piezoresistively and the signals are converted into voltages. The sensor deflection pattern allows one to characterize the condition of the patient. In a clinical pilot study, we investigated breath samples from head and neck cancer patients and healthy control persons. Evaluation using principal component analysis (PCA) allowed a clear distinction between the two groups. As head and neck cancer can be completely removed by surgery, the breath of cured patients was investigated after surgery again and the results were similar to those of the healthy control group, indicating that surgery was successful.
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- 2016
100. Giant Magnetoimpedance Sensors and Their Applications
- Author
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Hua-Xin Peng, Manh-Huong Phan, and Faxiang Qin
- Subjects
010302 applied physics ,Materials science ,Stress sensors ,Surface acoustic wave ,Giant magnetoimpedance ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,Engineering physics ,Magnetic field ,Stress (mechanics) ,Ac current ,0103 physical sciences ,Sensitivity (control systems) ,Current (fluid) ,0210 nano-technology - Abstract
Since GMI changes as a function of external dc magnetic field or applied dc/ac current, it is possible to design and produce GMI-based sensors that can measure either magnetic fields or dc/ac currents. GMI also changes sensitively with applied stress, and this provides a new opportunity to develop stress sensors. A brief description of these typical sensors is given in this chapter. It shows that the high sensitivity of GMI to applied magnetic field, current, and external stress is very useful for a wide range of industrial and engineering applications.
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- 2016
- Full Text
- View/download PDF
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