1,817 results on '"Mai, Y."'
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52. Efficacy of Dexamethasone as A Prophylaxis for Radiation-Induced Pain Flare after Palliative Radiotherapy for Symptomatic Bone Metastases
53. A study of ZnO:B films for thin film silicon solar cells
54. Study of thermal stability of ZnO:B films grown by LPCVD technique
55. Size-dependent absorption properties of CdX (X = S, Se, Te) quantum dots
56. AB0227 TREATMENT SEQUENCING PATTERNS AND COMPARATIVE EFFICACY IN PATIENTS WITH RHEUMATOID ARTHRITIS FROM A REAL-WORLD SETTING
57. Automated Extraction and Longitudinal Analysis of Ground Glass OpacityFeatures in Lung Cancer Patients Powered by Natural Language Processing
58. Phaeohyphomycosis due to Veronaea botryosa in cultured white sturgeon ( Acipenser transmontanus Richardson) from California USA during 2006 to 2015
59. Synthesis, Characterization and Antifungal Evaluation of Novel Pyridazin-3(2H)-One Derivatives
60. Improvement in adhesion of diamond film on Cu substrate with an inlay structured interlayer
61. Advanced Fibre Composites with Engineered Interfaces
62. Synthesis, Characterization and Antifungal Evaluation of Novel Pyridazin-3(2H)-One Derivatives
63. Lifetime of a gas pipe
64. Effect of crack size on fatigue life
65. Organosilicon functionalized quaternary ammonium ionic liquids as electrolytes for lithium-ion batteries
66. Influence of H2O/DEZ ratio on LPCVD ZnO:B films for application in a-Si:H/μc-Si:H tandem solar cells
67. Annealing embrittlement of Fe78Si9B13 (METGLAS-2605S2)
68. Synthesis, Characterization and Antifungal Evaluation of Novel Pyridazin-3(2H)-One Derivatives.
69. Practice of interprovincial public transport in Beijing–Tianjin–Hebei region
70. Subsystem testing of solder joints against drop impact
71. Fatigue crack growth in solder joints at high strain rate
72. Advances in diffusion and vapour pressure modelling
73. Dynamic deformation of a printed circuit board in drop-shock
74. Fatigue resistance of solder joints
75. Stresses in solder joints due to the bending deformation of printed circuit boards in microelectronics assemblies
76. Rate-dependent stress–strain properties of solders
77. Robust design of microelectronic assemblies against mismatched thermal expansion
78. Preface
79. Introduction
80. Moisture properties and their characterisations
81. The physics of failure of portable electronic devices in drop impact
82. Advances in creep-fatigue modelling of solder joints
83. Size and Notch Effects in Cementitious Materials
84. On the Fibre Pullout and Pushin Problem in Composite Materials with Controlled Interfaces
85. Association of biologic treatments with symptoms and adverse effects in patients with osteoarthritis - a network meta-analysis
86. Quasistatic Cracking of Materials with High Fracture Toughness and Low Yield Stress
87. Studies on Low-Field and Room-Temperature Magnetoresistance in La2/3(Ca1−x Sr x )1/3MnO3 Perovskites
88. LB710 Detection of novel BP180 epitopes in Pemphigoid Gestationis
89. Hemodynamic effects of norepinephrine versus phenylephrine infusion for prophylaxis against spinal anesthesia-induced hypotension in the elderly population undergoing hip fracture surgery: a randomized controlled trial
90. Size effect in microcompression of epoxy micropillars
91. Enhanced electrochemical performance of FeS2 synthesized by hydrothermal method for lithium ion batteries
92. Multi-holed clay nanotubes and their modification with a polyaniline nanolayer
93. Bonding rearrangement in amorphous silicon nitrides deposited by hot-wire chemical vapor deposition upon thermal annealing
94. High efficiency microcrystalline silicon solar cells with Hot-Wire CVD buffer layer
95. Mechanics of microtubules modeled as orthotropic elastic shells with transverse shearing
96. An exact analysis for mode III cracks between two dissimilar magnetoelectroelastic layers
97. Clinical Outcomes of COVID-19 Patients Treated with Convalescent Plasma or Remdesivir Alone and in Combination at a Community Hospital in California’s Central Valley
98. 175 Collective cell migration of stratified epithelia in confined microenvironments
99. Modeling surface electrodes on a piezoelectric layer
100. Accumulation Damage Mode for Ferroelectric Ceramics Subjected to Mode III Fatigue Loading Conditions
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