51. A New Ionic Type Photosensitive Polyimide For Microelectronics
- Author
-
K. Niwa, K. Kusano, M. Asano, and M. Eguchi
- Subjects
Materials science ,business.industry ,Ultimate tensile strength ,Ionic bonding ,Microelectronics ,Adhesive ,Adhesion ,Composite material ,business ,Thermal expansion ,Polyimide ,Characterization (materials science) - Abstract
Toray's Ionic type photosensitive polyimide, "Photoneece" is widly used as interdielectrics and protection layers for microelectronics because of its features such as removal of photoreactive groups at low temperature, excellent thermal, mechanical and electrical film properties and excellent adhesion to various substrates. Toray has developed new type "Photoneece" UR-5100, which is the low stress photosensitive polyimide. In addition to low thermal expansion coefficient (25ppm/"C), "Photoneece" UR-5100 features also high resolution with more than 2.0 aspect ratios in 40 pm imaged film and excellent mechanical properties of the cured film such as high elongation (>2OX) and tensile strength (>200MPa) even after 60 hours heat treatment at 350°C. "Photoneece" UR-5100 can be applied in multi-chip modules (MCMS), hybrid circuits, ICs and LSIs. In this report the characterization and processing of this "Photoneece" UR-5100 are described.
- Published
- 2005
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