51. Low-temperature atomic layer deposition-grown Al2O3 gate dielectric for GaN/AlGaN/GaN MOS HEMTs: Impact of deposition conditions on interface state density
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Lajos Tóth, Dagmar Gregušová, M. Ťapajna, Jan Kuzmik, Béla Pécz, L. Valik, Edmund Dobročka, F. Gucmann, S. Hascik, and Karol Fröhlich
- Subjects
Materials science ,Gate dielectric ,Analytical chemistry ,Oxide ,02 engineering and technology ,01 natural sciences ,Atomic layer deposition ,chemistry.chemical_compound ,Gate oxide ,0103 physical sciences ,MOSFET ,Materials Chemistry ,Electrical and Electronic Engineering ,Instrumentation ,Leakage (electronics) ,010302 applied physics ,business.industry ,Process Chemistry and Technology ,Wide-bandgap semiconductor ,021001 nanoscience & nanotechnology ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Semiconductor ,chemistry ,0210 nano-technology ,business - Abstract
The oxide/semiconductor interface state density (Dit) in Al2O3/AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistor (MOS-HEMT) structures with gate oxides grown by atomic layer deposition at low deposition temperature is analyzed in this work. MOS-HEMT structures with Al2O3 gate oxide were deposited at 100 and 300 °C using trimethylaluminum precursor and H2O and O3 oxidation agents. The structures were found to show negative net charge at oxide/barrier interface with density (Nint) of 1013 cm−2, which was attributed to the reduction of barrier surface donor density (NDS). Dit was determined using capacitance transient techniques, and the results were assessed by the simulations of the capacitance–voltage characteristics affected by interface traps. The results indicate a lower interface quality of the sample with Al2O3 grown using O3 agent compared to those with H2O, even though the former provided lowest gate leakage among the analyzed structures. Moreover, to uncover the NDS nature, Dit...
- Published
- 2017
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