91 results on '"Kuo, Jui-Chao"'
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52. Grain Boundary Evolution of Cold-Rolled FePd Alloy during Recrystallization at Disordering Temperature
53. Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
54. Texture and magnetic properties of electrodeposited FePd films
55. Current stressing-induced growth of Cu 3Sn in Cu/Sn/Cu solder joints
56. The Effect of Trace Amounts of Mg in FeCrAl Alloys on the Microstructure of the Protective Alumina Surface Scales
57. Extremely anisotropic single-crystal growth in nanotwinned copper
58. Corrosion Prevention and Environment Protection of Materials for a New Era
59. Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging.
60. Investigation of pulsed ultraviolet laser annealing of Sb/SnO 2 thin films on the structural, optical and electrical properties
61. The Effect of Atomic Mass on the Physical Spatial Resolution in EBSD
62. Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu
63. Comparison of deformation texture in FePd alloy via X-ray diffraction and electron backscatter diffraction techniques
64. Material Characteristics and Corrosion Performance of Heat-Treated Al-Zn Coatings Electrodeposited on AZ91D Magnesium Alloy from an Ionic Liquid
65. Preparing transparent conductive Sn/Sb–O2−x thin films by annealing bi-layer Sb/SnO2 with pulse UV laser
66. Application of Digital Image Correlation (DIC) on Magnetostriction of Fe-Pd Alloy
67. Using the Simplified 3D DIC Method to Measure the Deformation of 3D Surface
68. Effect of microscopic parameters on EBSD spatial resolution
69. Superconducting property and Fe valence state of FeSe thick films grown from high temperature solution
70. Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints
71. Pseudo-Hexagonal Composite Twins in Pulse Electroplated Copper
72. Determination of Mixing Time in a Ladle-Refining Process Using Optical Image Processing
73. Post-deposition annealing control of phase and texture for the sputtered MoO3 films
74. Bilateral filter based orientation smoothing of EBSD data
75. High‐Purity FeSe1−x Superconductors Prepared by Solid‐State Synthesis and Liquid Phase Processing
76. Extraction of Plastic Properties of Aluminum Single Crystal Using Berkovich Indentation
77. Growth and characterisation of multiferroic BiFeO3 films with fully saturated ferroelectric hysteresis loops and large remanent polarisations
78. Effect of Plating Current Density and Frequency on the Crystallographic Texture of Electrodeposited Copper
79. EBSD characterization of twinned copper using pulsed electrodeposition
80. Orientation Characterization of Columnar-Grained Aluminum at Triple Junctions
81. Experimental Investigation on Earing Behavior of Aluminum/Copper Bimetal Sheet
82. Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper
83. Investigation of pulsed ultraviolet laser annealing of Sb/SnO2 thin films on the structural, optical and electrical properties.
84. Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints
85. Growth and characterisation of multiferroic BiFeO3 films with fully saturated ferroelectric hysteresis loops and large remanent polarisations
86. Preparing transparent conductive Sn/Sb–O2−x thin films by annealing bi-layer Sb/SnO2 with pulse UV laser
87. Effect of cold deformation on the recrystallization behavior of FePd alloy at the ordering temperature using electron backscatter diffraction
88. EBSD analysis of magnesium addition on inclusion formation in SS400 structural steel
89. Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam
90. Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu.
91. Effect of Annealing Temperature and Oxygen Flow in the Properties of Ion Beam Sputtered SnO - ₂ x Thin Films.
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