51. Low temperature deposition of SiO insulator film with newly developed facing electrodes chemical vapor deposition
- Author
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Hiroshi Furuta, Toshiyuki Kawaharamura, Takahiro Hiramatsu, Mamoru Furuta, Tokiyoshi Matsuda, and Takashi Hirao
- Subjects
Materials science ,Analytical chemistry ,Insulator (electricity) ,Chemical vapor deposition ,Plasma ,Condensed Matter Physics ,Surfaces, Coatings and Films ,chemistry.chemical_compound ,chemistry ,Thin-film transistor ,Electric field ,Electrode ,Breakdown voltage ,Instrumentation ,Tetramethylsilane - Abstract
Insulating SiO x film was deposited with newly developed plasma source at low temperature for fabrication of flexible devices on plastic substrate. The plasma was generated with electromagnetic field by two facing electrodes including magnets inside and covered with SiO 2 targets. The higher deposition rate was achieved from 2.0 to 33 nm/min, with the mixture of tetramethylsilane and oxygen as source gases. The insulating properties were obtained as 3 × 10 −8 A/cm 2 at the electric field of 1 MV/cm, and the breakdown voltage of 5 MV/cm at 1 × 10 −6 A/cm 2 for the film deposition rate at 11.6 nm/min. High density plasma enhanced by magnetic field would be the hopeful solution for gate insulator deposited at high deposition rate with low temperature.
- Published
- 2014
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