304 results on '"Claeys W"'
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52. Heterodyne lock-in thermal coupling measurements in integrated circuits: Applications to test and characterization
53. A heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits
54. Laser scanning thermomechanical imaging of microelectronic devices
55. Using Temperature as Observable of the Frequency Response of RF CMOS Amplifiers
56. OPTICAL NONLINEARITIES OF UNILAMELLAR PHOSPHOLIPID-VESICLES SUSPENSIONS ANALYZED BY A PHASE CONJUGATION EXPERIMENT
57. Laser scanning thermoreflectance imaging system using galvanometric mirrors for temperature measurements of microelectronic devices
58. Coherent phonons inSi∕SiGesuperlattices
59. Joule expansion imaging techniques on microlectronic devices
60. High-resolution interferometry and electronic speckle pattern interferometry applied to the thermomechanical study of a MOS power transistor
61. Développement d'une méthode originale d'imagerie haute résolution en temps réel à travers un milieu absorbant : application aux circuits microélectroniques
62. Dynamic Surface Temperature Measurements in ICs
63. LIQUID-MEDIA FOR PHASE CONJUGATION - COMPOSITE MEDIA AND MICROEMULSIONS
64. Study of thermomechanical properties of Si∕SiGe superlattices using femtosecond transient thermoreflectance technique
65. Thermoreflectance calibration procedure on a laser diode: application to catastrophic optical facet damage analysis
66. The Kinetics of Heat-Induced Structural Changes of β-Lactoglobulin
67. Temperature variation mapping of a microelectromechanical system by thermoreflectance imaging
68. Simulation of Si/SiGe micro-cooler by thermal quadrupoles method
69. Calibration procedure for temperature measurements by thermoreflectance under high magnification conditions
70. Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing: a new method for measuring the bond quality.
71. Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI)
72. High resolution interferometry (HRI) and electronic speckle pattern interferometry (ESPI) applied to the thermomechanical study of a MOS power transistor
73. Simultaneous topographic and thermal imaging of silicon nanowires using a new SThM probe.
74. Imaging setup for temperature, topography, and surface displacement measurements of microelectronic devices
75. Thermal and thermomechanical study of micro-refrigerators on a chip based on semiconductor heterostructures.
76. Thermal coupling in integrated circuits: application to thermal testing
77. Determination of ZT of PN thermoelectric couples by AC electrical measurement.
78. Strain imaging in thermoelectric devices by laser probe shearography.
79. Study of the thermal behaviour of PN thermoelectric couples by laser probe interferometric measurement.
80. Thermal testing: fault location strategies.
81. Thermomechanical effects in metal lines on integrated circuits analysed with a differential polarimetric interferometer
82. Thermomechanical deformation imaging of power devices by electronic speckle pattern interferometry (ESPI)
83. Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing : a new method for measuring the bond quality
84. Thermoreflectance measurements of transient temperature upon integrated circuits: application to thermal conductivity identification
85. Modelling and experimental study of heat deposition and transport in a semiconductor laser diode
86. BiCMOS thermal sensor circuit for built-in test purposes
87. High sensitivity and high resolution differential interferometer: Micrometric polariscope for thermomechanical studies in microelectronics
88. The method of dynamic separation and its application to quantitative thermal analysis of microelectronic devices by laser interferometry and reflectometry
89. LASER PROBE MEASUREMENTS OF QUALITY EVOLUTION OF SOLDER JOINTS DURING THERMAL CYCLING AGEING TESTS
90. Laser beam thermography of circuits in the particular case of passivated semiconductors
91. Absolute measurement of transient carrier concentration and temperature gradients in power semiconductor devices by internal IR-laser deflection
92. Organic material concentration in auditory outer hair cells measured by laser interferometry
93. Optical ammeter for integrated circuit characterization and failure analysis
94. Interferences of Peltier thermal waves produced in ohmic contacts upon integrated circuits
95. Laser probing of thermal behaviour of electronic components and its application in quality and reliability testing
96. Early detection of ageing in solder joints through laser probe thermal analysis of the peltier effect
97. Thermoreflectance optical test probe for the measurement of current-induced temperature changes in microelectronic components
98. Non-linéarités optiques de suspensions de vésicules phospholipidiques unilamellaires analysées par une expérience de conjugaison de phase
99. Thermomechanical and electromigration studies with a high sensitive and high resolution laser probe.
100. Absolute dynamic measurements of temperature changes in electronic components from a thermoreflectance optical test probe.
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