651. Impact of interlayer application on band bending for improved electron extraction for efficient flexible perovskite mini-modules
- Author
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Romain Carron, Stefano Pisoni, Oliver Groening, Stephan Buecheler, Ayodhya N. Tiwari, Fan Fu, Thierry Moser, and Roland Widmer
- Subjects
Materials science ,ch3nh3pbi3 ,Aperture ,laser scribing ,Perovskite solar cell ,02 engineering and technology ,Electron ,010402 general chemistry ,01 natural sciences ,law.invention ,law ,General Materials Science ,Electrical and Electronic Engineering ,Perovskite (structure) ,Renewable Energy, Sustainability and the Environment ,business.industry ,Extraction (chemistry) ,021001 nanoscience & nanotechnology ,Laser ,perovskite solar cell ,0104 chemical sciences ,laser ,Band bending ,solar-cells ,interlayer ,transport ,Optoelectronics ,solar module ,layers ,flexible ,0210 nano-technology ,business ,Laser scribing ,performance - Abstract
The development of highly efficient lightweight flexible perovskite solar cells (PSCs) opens the way to high-throughput roll-to-roll manufacturing processes and new applications such as building integration and mobile products. Flexible PSCs are generally realized on small areas (< 0.2 cm(2)), far from technology commercialization where modules-scale is necessary. In this work, we demonstrate highly efficient n-i-p PSCs grown on flexible substrates by proper interface engineering for improved electron extraction. We compared spin coated PEIE and vacuum deposited LiF as interlayers between Al-doped ZnO, as transport conductive oxide (TCO), and thermally evaporated C-60, as electron transport layer (ETL). Once interlayers are applied, we observed a favorable band bending at TCO interface which results in enhanced charge extraction and lower recombination losses. We achieved flexible PSCs with stabilized efficiencies of 14.8%, both with PEIE and LiF interfacial modifications., In addition, we developed a flexible perovskite mini-module with stabilized efficiency of 10.5% onto an aperture area larger than 10 cm(2). The monolithic interconnections are entirely obtained by highly accurate and reliable laser scribing methods. A geometric fill factor as high as similar to 94% is achieved, with a dead area width of similar to 250 mu m.