1. TECHNICAL CONFERENCE COURSES.
- Subjects
PRINTED circuits industry ,SEMINARS ,CONFERENCES & conventions ,CSP (Computer program language) ,FLIP chip technology ,THREE-dimensional display systems ,INTEGRATED passive components - Abstract
Provides information on the technical courses and seminars to be offered at the 10th Annual Printed Circuit Board Design Conference East 2005 in Manchester, New Hampshire in October 2005. Target attendees of the course Let's Get Smaller, Better and Cheaper: CSP, Flip Chip and 3D Technologies; Focus of the class discussion in the course Introduction to Fullwave SI and EMC Modeling; Subjects to be discussed in the seminar Introduction to Embedded Passives, which are important for designer and engineers who plan to launch their own embedded passives.
- Published
- 2005