1. Panasonic Opens U.S. Advanced Packaging Lab.
- Author
-
Buetow, Mike
- Subjects
RESEARCH institutes ,ELECTRONIC packaging ,MICROELECTRONIC packaging ,FLIP chip technology ,WIRE bonding (Electronic packaging) - Abstract
The article features the Advanced Packaging Lab of Panasonic Factory Solutions Co. of America launched in June 2007. Reportedly the first outside Japan, the facility, located at the company's Chicago headquarters, contains state-of-the-art process equipment. Among the operations that the facility can reportedly do are thin-die stacking, wire bonding, multichip bonding and ultrasonic flip-chip bonding. Said to be the first in the U.S., customers can qualify samples on high-volume production equipment. According to the article, the facility which can provide live process demonstrations will benefit the U.S. microelectronics business.
- Published
- 2007