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This article focuses on the 2005 Mask Magnification/Field Size Workshop sponsored by the Austin, Texas-based research and development consortium Sematech held in Belgium. The workshop concluded that the existing lithography mask standard of 4x magnification with a 26-millimeter field size is likely resilient enough to take the semiconductor industry to the 32-nanometer half-pitch generation. Participants at the workshop also reached consensus that moving to new mask ratios, fields and reticle sizes is not likely to be needed. Attendees expressed confidence that mask suppliers would be ready for 32-nanometer half-pitch lithography by 2010. Participants however did identify a list of critical issues that could necessitate a change in magnification, field size or photomask standards, if the underlying assumptions on the progress of the industry regarding these critical issues are not met.