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In this study, an advanced supercritical fluid (SCF) technique that is suitable for materials and electronic devices with low temperature (80 °C) and high pressure (4000 psi) is proposed for a ZnO-based resistive random access memory (RRAM). After an SCF treatment, X-ray photoelectron spectroscopy (XPS) analysis confirms that the concentration of oxygen ions increases in the zinc oxide thin film. Moreover, electrical measurements confirm that the treated ZnO-based random access memory exhibits a lower forming voltage, lower set voltage, and higher ratio of high and low resistance states compared with a device without treatment. Next, the carrier transport mechanism is investigated by fitting the current–voltage curves. Finally, physical models are introduced to illustrate the extra oxygen ions that create better memory characteristics in the random access memory device after the SCF treatment. This significant SCF technique increases the content of oxygen ions without altering the original element ratio and maintains a simple device structure. Thus, the technique shows potential for feasible material improvement capable of effective real applications in the near future. [ABSTRACT FROM AUTHOR]

Herein, the supercritical hydrogen treatment is proposed to improve the performance of zinc oxide‐based resistive random access memory. After treatment, the treated device not only achieves the forming‐free characteristic but also gets enhanced in its memory window, reset voltage, and reliability. Moreover, X‐Ray photoelectron spectroscopy analysis confirms the forming‐free characteristic of the treated device since the treatment decreases the concentration of ZnO bonding in the zinc oxide thin film, leading the conductive filament to be constructed in the zinc oxide switching layer. Next, the carrier transport mechanism is investigated by fitting current–voltage curves. Finally, the physical models based on the electrical properties and the material analyses are introduced to illustrate the oxygen ions and hydroxide ions that create the forming‐free characteristic and better memory characteristics in the random access memory device after the supercritical fluid treatment. Hence, this method demonstrates the promising practical and effective utilization of enhancing memory devices, in the future. [ABSTRACT FROM AUTHOR]