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This paper presents a thermal Fluid-Structure Interaction (FSI) study of Printed Circuito Bards (PCBs) during wave soldering. The influences of PCB thickness on displacement, stress, and temperature distribution are the foci of this study. Five PCB thicknesses (i.e., 0.6, 1.0, 1.6, 2.4, and 3.1 mm) are considered. The paper focuses on a simple PCB with a single hole and is constructed in a three-dimensional model. The thermal FSI of the PCB is solved by fluid (FLUENT) and structure (ABAQUS) solvers that are connected using the mesh-based parallel code coupling interface method. Molten solder advancement is tracked using volume-of-fluid technique in the thermal fluid analysis. ABAQUS solves PCB displacement, von Mises stress, and temperature distributions when high solder temperature is encountered during wave soldering. The correlations of PCB thickness with displacement, von Mises stress, temperature distribution, and molten solder filling time are studied. Results reveal that an increase in PCB thickness yields a linear correlation with solder filling time. Temperature distribution, von Mises stress, and displacement of PCB exhibit polynomial behavior to PCB thickness. A laboratory-scale two-way wave-soldering machine is also used to measure PCB temperature during wave soldering. The predicted temperature of PCB is substantiated by the experimental results. [ABSTRACT FROM AUTHOR]

This study investigated the effects of temperature on the wave soldering of printed circuit boards (PCBs) using three-dimensional finite volume analysis. A computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using tetrahedral elements. The leaded molten solder (Sn63Pb37) distribution and PCB wetting profile were determined using the volume of fluid technique in the fluid flow solver, FLUENT. In this study, the effects of five different molten solder temperatures (456 K, 473 K, 523 K, 583 K, and 643 K) on the wave soldering of a 70 mm × 146 mm PCB were considered. The effects of temperature on wetting area, wetting profile, velocity vector, and full wetting time were likewise investigated. Molten solder temperature significantly affected the wetting time and distribution of PCBs. The molten solder temperature at 523 K demonstrated desirable wetting distribution and yielded a stable fountain profile and was therefore considered the best temperature in this study. The simulation results were substantiated by the experimental results. [ABSTRACT FROM AUTHOR]

This study aims to investigate the influence of a conveyor angle on capillary flow during the wave soldering process. Finite volume-based simulation is utilized to study the capillary flow of molten solder. Molten solder filling through capillary action of a pin-through-hole (PTH) is considered at different conveyor angles (i.e., 0–10°). Two PTH positions, namely, center (r/R = 0.2) and offset (r/R = 0.6), are investigated. The effects of a conveyor angle on molten solder filling volume, time, pressure profile, and velocity vector are numerically analyzed. [ABSTRACT FROM AUTHOR]

Purpose -- This paper aims to investigate the thermal fluid-structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation. Design/methodology/approach -- The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm[sup 3]), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results. Findings -- Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress. Practical implications -- This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry. Originality/value -- This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process. [ABSTRACT FROM AUTHOR]

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An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin throughhole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183℃) < T < 643.15K (370℃). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature.The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry. [ABSTRACT FROM AUTHOR]