17 results on '"Hockett, Mike"'
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2. RETURNING THE POWER: Vendors constantly challenged to find efficiency gains in regenerative power supplies & loads
3. MEA, INSTRUMENT CONSOLIDATION PUSHING VENDORS TO INNOVATE
4. VENDORS RAMP UP MMWAVE FUNCTIONALITY, RTSA OFFERINGS IN SOLUTIONS
5. SEMICONDUCTOR TEST: VENDORS CHALLENGED BY COST OF TEST AMID INCREASING DEVICE COMPLEXITY
6. DATA DEMANDS: Turnkey use, portability, and real-time analysis among customers' DAQ must-haves
7. A HIGHER POWER: Power semiconductor test vendors discuss trends and challenges in SiC, GaN, IGBT, and more
8. POWER PLAY: Programmable power supplies & loads vendors tackle renewable energy, power efficiency
9. SAFETY FIRST: Electrical safety test vendors packing value-adds into solutions
10. SWITCHING VENDORS CHALLENGED TO MEET BANDWIDTH DEMANDS
11. THE OPTICS ARE GOOD: Vendors weigh in on developments in optical communications technology and test solutions
12. CISPR COMPLIANCE, REAL-TIME ANALYSIS DRIVING INNOVATION IN EMI/EMC INSTRUMENTS
13. EE'S SIGHTS FROM APEC 2019
14. Q&A: SIMULATION'S VITAL ROLE IN WIRELESS TESTING
15. CYBERSECURITY: SHIELDING AGAINST THE DARK SIDE
16. Following up on 'brain drain' in test engineering
17. Cobots and humans: Can we get along?
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