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1. SMALL, BUT MIGHTY: Portable instrumentation vendors challenged to pack robust features into small form factors

2. RETURNING THE POWER: Vendors constantly challenged to find efficiency gains in regenerative power supplies & loads

3. MEA, INSTRUMENT CONSOLIDATION PUSHING VENDORS TO INNOVATE

4. VENDORS RAMP UP MMWAVE FUNCTIONALITY, RTSA OFFERINGS IN SOLUTIONS

5. SEMICONDUCTOR TEST: VENDORS CHALLENGED BY COST OF TEST AMID INCREASING DEVICE COMPLEXITY

6. DATA DEMANDS: Turnkey use, portability, and real-time analysis among customers' DAQ must-haves

7. A HIGHER POWER: Power semiconductor test vendors discuss trends and challenges in SiC, GaN, IGBT, and more

8. POWER PLAY: Programmable power supplies & loads vendors tackle renewable energy, power efficiency

9. SAFETY FIRST: Electrical safety test vendors packing value-adds into solutions

10. SWITCHING VENDORS CHALLENGED TO MEET BANDWIDTH DEMANDS

11. THE OPTICS ARE GOOD: Vendors weigh in on developments in optical communications technology and test solutions

12. CISPR COMPLIANCE, REAL-TIME ANALYSIS DRIVING INNOVATION IN EMI/EMC INSTRUMENTS

13. EE'S SIGHTS FROM APEC 2019

14. Q&A: SIMULATION'S VITAL ROLE IN WIRELESS TESTING

15. CYBERSECURITY: SHIELDING AGAINST THE DARK SIDE

16. Following up on 'brain drain' in test engineering

17. Cobots and humans: Can we get along?

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