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Plasmas, known to emit high levels of vacuum ultraviolet (VUV) radiation, are used in the semiconductor industry for processing of low-k organosilicate glass (SiCOH) dielectric device structures. VUV irradiation induces photoconduction, photoemission, and photoinjection. These effects generate trapped charges within the dielectric film, which can degrade electrical properties of the dielectric. The amount of charge accumulation in low-k dielectrics depends on factors that affect photoconduction, photoemission, and photoinjection. Changes in the photo and intrinsic conductivities of SiCOH are also ascribed to the changes in the numbers of charged traps generated during VUV irradiation. The dielectric-substrate interface controls charge trapping by affecting photoinjection of charged carriers into the dielectric from the substrate. The number of trapped charges increases with increasing porosity of SiCOH because of charge trapping sites in the nanopores. Modifications to these three parameters, i.e., (1) VUV induced charge generation, (2) dielectric-substrate interface, and (3) porosity of dielectrics, can be used to reduce trapped-charge accumulation during processing of low-κ SiCOH dielectrics. Photons from the plasma are responsible for trapped-charge accumulation within the dielectric, while ions stick primarily to the surface of the dielectrics. In addition, as the dielectric constant was decreased by adding porosity, the defect concentrations increased. [ABSTRACT FROM AUTHOR]

The reflectance of low-k porous organosilicate glass (SiCOH) as a function of photon energy under synchrotron vacuum ultraviolet (VUV) radiation was measured using a nickel mesh reflectometer. The authors found that during VUV irradiation, the reflectance of SiCOH and the substrate current were inversely correlated. Thus, reflectance can be inferred from substrate current measurements and vice versa. The authors conclude that reflectance or substrate current measurements can determine the photon energies that are absorbed and, therefore, cause dielectric damage during processing. Thus, reducing the flux of deleterious photon energies in processing systems can minimize dielectric damage. [ABSTRACT FROM AUTHOR]

Vacuum-ultraviolet irradiation produces trapped charges in dielectrics. The trapped charges often generate self-consistent electric fields. A Monte Carlo simulation coupled with a Poisson equation solver is used to model the relationship between the irradiation photon flux and electrostatic potential. The simulation includes photoconduction, photoemission, photoinjection, and the effects of self-consistent electric fields. Calculations show that photoemission and photoinjection are responsible for changes in the electric potential as photon dose or dielectric thicknesses are varied. Experimental surface-potential measurements were made to compare the results of the simulation. [ABSTRACT FROM AUTHOR]