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This work aims to validate the feasibility of device-level analysis to reflect the effects of fabrication processes and operations, as contrasted with the conventional method of x-ray photoelectron spectroscopy (XPS), which is widely employed in amorphous oxide semiconductor thin-film transistors (TFTs) but analyzes film-level specimens. First, an analysis setup was introduced to determine the optimal x-ray target position for device-level XPS, where the intensity of channel components is maximized, through imaging XPS. Then, to demonstrate the effectiveness of this approach, the impact of channel composition and bias-stress was investigated through the implementation of device-level XPS on bottom-gate InGaZnO TFTs. The cationic composition ratios of the fabricated TFTs varied from 0.27:1:1.33 (In:Ga:Zn) and 0.28:1:2.21 when the subcycle of the Zn precursor increased by a factor of 1.5 in the atomic-layer deposition process. The device with a higher Zn ratio exhibited a more negative turn-on voltage and a twice larger subthreshold swing. These characteristics were validated from the comparisons in the relative amount of oxygen vacancies in O 1s of the channel and interface regions by 8.4%p and 5.6%p, respectively, between the devices. Furthermore, the electron trapping effect was verified for the devices subjected to a positive gate bias-stress of 3 MV/cm, as evidenced by the changes in the binding energy difference (0.35 eV) between the channel and gate insulator layers, in comparison to the non-stressed device. Consequently, this work demonstrates that device-level XPS can be an effective tool for understanding TFTs' characteristics in various ways beyond film-level analysis. [ABSTRACT FROM AUTHOR]

Abstract: This paper presents a high-uniformity post-CMOS fabricated uncooled microbolometer focal plane array (MFPA) integrated with an active matrix circuit. The MFPA is consisted of 64 by 64 microbolometer cells. To improve the output non-uniformity, the active matrix circuit with column-wise transistor-sharing scheme is proposed. The active matrix circuit selects the row and column of MFPA, calibrates the output offset and the output gain, and converts the resistance changes of MFPA to the output currents. The output non-uniformity with the proposed scheme is reduced to 26 %, compared to the conventional scheme. [Copyright &y& Elsevier]