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Among the numerous advantages of the high-power impulse magnetron sputtering (HiPIMS) technique, the most important is the enhanced ionization degree of sputtered species contributing to the film growth. Consequently, the quality of deposited thin films is highly improved. Still, the optimization process is challenging due to the complexity associated with the intricate transport of the sputtered species, ionized or neutrals. The scarce knowledge available on the spatial distribution of these species when operating a HiPIMS discharge makes the quantitative prediction of any deposition feature particularly difficult. In this paper, we discuss the influence of experimentally controllable quantities, such as gas pressure and target current density, on the transport of sputtered titanium in non-reactive (argon) HiPIMS, namely, on the behavior of metal atoms and metal ion fluxes intercepting the substrate. Systematic quantitative measurements were performed in a diameter normal plane on a circular planar target. Hence, the 2D spatial distribution of the ionized flux fraction (IFF) and the total flux of titanium sputtered particles (deposition rate) are evaluated by biasing a quartz crystal microbalance equipped with an electron magnetic filter. The wide range of parameters we examined allows us to predict and optimize the flux of sputtered species based on complete mapping of the IFF of sputtered particles. [ABSTRACT FROM AUTHOR]

This study investigates the vapor chemical composition, during the melting step of an electron beam powder bed fusion process using Ti–6Al–4V powder. A phenomenological model is proposed to analyze and discuss the vapor composition. The model focus on the heat dissipation of the molten powder. Vapor stream from the molten powder is compounded by vapor saturation pressure and rapid boiling (ebullition) of the molten pool. The model is based on post mortem results of condensed vapor (thin film), which were analyzed by X-ray photoelectron spectroscopy and glow discharge optical emission spectrometry, providing quantitative and in-depth profile data. It was found that the ratio of [Al] to [Ti] in the vapor stream is influenced by the melting conditions. As the e-beam current increases, the heat dissipation reaches the ebullition domains, and the [Al]/[Ti] ratio tends to the molar ratio of the precursor powder (Ti–6Al–4V), indicating the complete overheating of all the alloy elements. [ABSTRACT FROM AUTHOR]

High-power impulse magnetron sputtering (HiPIMS) is an ionized physical vapor deposition technique that provides a high flux of ionized target species for thin film growth. Optimization of HiPIMS processes is, however, often difficult, since the influence of external process parameters, such as working gas pressure, magnetic field strength, and pulse configuration, on the deposition process characteristics is not well understood. The reason is that these external parameters are only indirectly connected to the two key flux parameters, the deposition rate and ionized flux fraction, via two internal discharge parameters: the target atom ionization probability αt and the target ion back-attraction probability βt. Until now, it has been difficult to assess αt and βt without resorting to computational modeling, which has hampered knowledge-based optimization. Here, we present a simple method to deduce αt and βt based on measured deposition rates of neutrals and ions. The core of the method is a refined analytical model, which is described in detail. This approach is furthermore validated by independent calculations of αt and βt using the considerably more complex ionization region model, which is a plasma-chemical global discharge model. [ABSTRACT FROM AUTHOR]

Thin and ultrathin carbon films reduce the laser energy required for copper powder fusion in selective laser melting (SLM). The low absorption of infrared (IR) radiation and its excellent thermal conductivity leads to an intricate combination of processing parameters to obtain high-quality printed parts in SLM. Two carbon-based sacrificial thin films were deposited onto copper to facilitate light absorption into the copper substrates. Graphite-like (3.5 µm) and ultra-thin (25 nm) amorphous carbon films were deposited by aerosol spraying and direct current magnetron sputtering, respectively. The melting was analyzed for several IR (1.06 µm) laser powers in order to observe the coating influence on the energy absorption. Scanning electron microscopy showed the topography and cross-section of the thermally affected area, electron backscatter diffraction provided the surface chemical composition of the films, and glow-discharge optical emission spectroscopy (GDOES) allowed the tracking of the in-deep chemical composition of the 3D printed parts using carbon film-covered copper. Ultra-thin films of a few tens of nanometers could reduce fusion energy by about 40%, enhanced by interferences phenomena. Despite the lower energy required, the melting maintained good quality and high wettability when using top carbon coatings. A copper part was SLM printed and associated with 25 nm of carbon deposition between two copper layers. The chemical composition analysis demonstrated that the carbon was intrinsically removed during the fusion process, preserving the high purity of the copper part. [ABSTRACT FROM AUTHOR]

Ion bombardment during film growth usually induces high compressive stress in compound thin film materials, resulting in rupture and failure of coated tools used in tribological applications. Hence‚ intrinsic stress generated during film growth can drastically limit the industrial appeal of deposition technologies such as high power impulse magnetron sputtering (HiPIMS). This work investigates how to reduce high stress levels by tuning the HiPIMS discharge conditions and selecting the appropriate substrate bias configuration. The strategy is based on optimizing the process discharge parameters, leading to HiPIMS discharges containing fewer multiply charged energetic metal ions, which is combined with pulsed substrate bias synchronized to the HiPIMS pulse to control the chemical nature of the incident ions‚ i.e. ‚ inert gas vs. metal ions. The study was performed during growth of TiN thin films, due to their relevance as a protective coating, and the intrinsic stress was measured in situ during film growth using the wafer curvature method and a multi-beam optical stress sensor. The results show that for standard HiPIMS discharges and biased substrates‚ the energetic metal ion bombardment results in very dense, compact microstructures, but highly stressed TiN films. On the other hand‚ when using the here proposed strategy mentioned above‚ the compressive stress was considerably reduced (by a factor 11) while retaining rather compact microstructures compared to direct current magnetron sputtered as well as non-biased HiPIMS samples. • Low stress TiN films are obtained by low-energy ion bombardment in HiPIMS. • A new process window is found between standard HiPIMS and DCMS discharges. • TiN film properties are fine-tuned using synchronized pulsed substrate bias. [ABSTRACT FROM AUTHOR]

• Amorphous carbon-based films reduce the reflectance of copper by up to 70%. • Stainless-steel /carbon target was used for carbon-based films. • 50% at. Fe*(Ni, Cr) in amorphous carbon reduces the resistivity by a factor of 100. • Fe* enhances light absorption coefficient. • Total reflectance reduction is observed in a broad spectrum. Amorphous carbon-based coatings deposited on copper substrates by magnetron sputtering at different target-to-substrate distances were investigated. Films deposited at short distances as 2 cm presented the best results in terms of morphology, density, and resistivity. Ultraviolet near-infrared range spectrometry measurements determined total reflectance and ellipsometry, extinction coefficient, refraction index, and pseudo bandgap. Amorphous carbon films of 150 nm deposited at 2 cm reduced the total reflectance by up to 60 ± 5% in the near-infra-red range when compared to pure copper films. The addition of Fe* boosts the absorption of the coating reducing the total reflectance by up to 70 ± 5% in near-infrared. (Fe*: deposited from stainless-steel target used in direct-current magnetron sputtering). Also, Fe* reduces the electrical resistivity by a factor of 100 compared to that of pure amorphous carbon films. The reduction in total reflectance induced by the presence of the amorphous carbon-based films on copper depends, as expected, on light penetration depth and the absorption coefficient. [ABSTRACT FROM AUTHOR]