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We conducted a comprehensive investigation on the influence of TiN thickness and stress on the ferroelectric properties of Hf 0.5 Zr 0.5 O 2 thin films. TiN top electrode layers with varying thicknesses of 2, 5, 10, 30, 50, 75, and 100 nm were deposited and analyzed. It was observed that the in-plane tensile stress in TiN films increased with the thickness of the TiN top electrode. This is expected to elevate the tensile stress in the Hf 0.5 Zr 0.5 O 2 film, consequently leading to an enhancement in ferroelectric polarization. However, the effect of stress on the ferroelectric behavior of Hf 0.5 Zr 0.5 O 2 films exhibited distinct stages: improvement, saturation, and degradation. Our study presents novel findings revealing a saturation and degradation phenomenon of in-plane tensile stress on the ferroelectric properties of polycrystalline Hf 0.5 Zr 0.5 O 2 films, thereby partially resolving the discrepancies between experimental observations and theoretical predictions. The observed phase transformation induced by tensile stress in Hf 0.5 Zr 0.5 O 2 films played a crucial role in these effects. Furthermore, we found that the impact of the TiN top electrode thickness on other factors influencing ferroelectricity, such as grain size and oxygen vacancies, was negligible. These comprehensive results offer valuable insights into the influence of stress and TiN top electrode thickness on the ferroelectric behavior of Hf 0.5 Zr 0.5 O 2 films. [ABSTRACT FROM AUTHOR]

Hf0.5Zr0.5O2 (HZO) is a promising candidate for low-power non-volatile memory due to its nanoscale ferroelectricity and compatibility with silicon-based technologies. Stress and oxygen vacancy (VO) are key factors that impact the ferroelectricity of HZO. However, their combined effects have not been extensively studied. In this study, we investigated the impact of the VO content on HZO thin films' ferroelectricity under different electrode stresses by using TiN and tungsten (W) top electrodes and controlling ozone dose time during HZO deposition. The HZO thin films with W top electrodes exhibit elevated stress levels and a greater abundance of orthorhombic/tetragonal phases, and the HZO thin films with TiN top electrode shows an increase in the monoclinic phase with increasing ozone dose time. The residual polarization (Pr) of the capacitors with TiN and W top electrodes displayed different or even opposing trends with increasing ozone dose time, and the VO content decreases with increasing ozone dose time for both sets of capacitor samples. We propose a model to explain these observations, considering the combined influence of electrode stresses and VO on the free and formation energy of the crystalline phase. Increasing the VO content promotes the transformation of the tetragonal phase to the orthorhombic phase in HZO films with TiN top electrodes, and with W top electrodes, a higher VO content prevents the tetragonal phase from transforming into the orthorhombic/monoclinic phase. Additionally, an alternative explanation is proposed solely from the perspective of stress. These findings provide valuable insights into the regulation of ferroelectricity in HZO thin films. [ABSTRACT FROM AUTHOR]

The ferroelectric field effect transistor (FeFET) is a very promising candidate for low-power and non-volatile memory. However, the co-existing effect of ferroelectric polarization and interface charge trapping in the FeFETs is demonstrated and many efforts have been made to eliminate this charge-trapping effect, which is usually treated as a deleterious effect. In contrast, we have found that the charge-trapping effect can play a dominant role in ferroelectric gates. In this work, we have verified that the charge-trapping effect of the ferroelectric/insulator interface could induce a memory window as the main physical mechanism in the TiN/Hf0.5Zr0.5O2/SiO2/p-Si (MFIS) structure, in which the ferroelectric characteristics of HZO thin films was verified through a reverse-grown MFIS structure. We also demonstrated that 2.5 nm SiO2 is optimal for the charge tunneling effect and the device has the largest memory window. Moreover, in order to enlarge the memory window of MFIS capacitors, we utilized the stress-enhanced ferroelectric polarization characteristics of Hf0.5Zr0.5O2 to improve the charge-trapping effect. Such a finding demonstrates that the ferroelectric-aided charge-trapping devices are potential to be used in non-volatile memories. [ABSTRACT FROM AUTHOR]