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We have developed large-format, close-packed X-ray microcalorimeter arrays fabricated on solid substrates, designed to achieve high energy resolution with count rates up to a few hundred counts per second per pixel for X-ray photon energies up to 8 keV. Our most recent arrays feature 31-micron absorbers on a 35-micron pitch, reducing the size of pixels by about a factor of two. This change will enable an instrument with significantly higher angular resolution. In order to wire out large format arrays with an increased density of smaller pixels, we have reduced the lateral size of both the microstrip wiring and the Mo/Au transition-edge sensors (TES). We report on the key physical properties of these small TESs and the fine Nb leads attached, including the critical currents and weak-link properties associated with the longitudinal proximity effect. [ABSTRACT FROM PUBLISHER]

For future X-ray astrophysics missions, X-ray microcalorimeters can be optimized with different properties in different regions of the focal plane. This approach has the potential to improve microcalorimeter instrument capabilities with efficient use of instrument resources. For example a point-source array optimized for high angular resolution, high count-rate observations could be accompanied by a main array to expand the field of view for diffuse observations. In this approach, it is desirable to be able to simultaneously optimize different transition-edge sensor (TES) geometries on a single wafer design. The key properties of TESs such as transition temperature and shape are a strong function of size and geometry due to the complex interplay between the proximity effect from the superconducting bias electrodes and the normal metal features used for noise suppression and absorber contact. As a result, devices fabricated with the same deposited layer but with different sizes will have different transition temperatures and different response to X-ray events. In this paper, we present measurements of the transition temperature and properties of devices with different sizes and normal metal features, and discuss how by tuning the geometry we can achieve the desired pixel parameters for a given application. We also describe measurements of transition properties from large-format hybrid arrays containing three different pixel types. [ABSTRACT FROM AUTHOR]

We are exploring the properties of electron-beam evaporated molybdenum thin films on silicon nitride coated silicon wafers at substrate temperatures between room temperature and 650 °C. The temperature dependence of film stress, transition temperature, and electrical properties are presented. X-ray diffraction measurements are performed to gain information on molybdenum crystallite size and growth. Results show the dominant influence of the crystallite size on the intrinsic properties of our films. Wafer-scale uniformity, wafer yield, and optimal thermal bias regime for TES fabrication are discussed. [ABSTRACT FROM PUBLISHER]