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This paper reports our developments for Micro LED laser lift‐off which is a very important step in Micro LED mass transfer process. By selecting the temporary bonding material, optimizing laser power intensity, and using PSS structure, the yield of Micro LED laser lift‐off can reach 99% for more than 5000 LEDs. This technical developments is of great potential for promoting high‐yield mass transfer technology to realize commercial Micro‐LED displays. [ABSTRACT FROM AUTHOR]

This paper reports our developments for Micro LED laser lift‐off which is a very important step in Micro LED mass transfer process. By selecting the temporary bonding material, optimizing laser power intensity and other process parameters, the yield of Micro LED laser lift‐off can reach 99.87% for more than 1500 LEDs. This technical developments is of great potential for promoting high‐yield mass transfer technology to realize commercial Micro‐LED displays. [ABSTRACT FROM AUTHOR]

This paper reports our developments for Micro LED laser lift‐off which is a very important step in Micro LED mass transfer process. By selecting the temporary bonding material, optimizing laser power intensity and other process parameters, the yield of Micro LED laser lift‐off can reach 99.87% for more than 1500 LEDs. This technical developments is of great potential for promoting high‐yield mass transfer technology to realize commercial Micro‐LED displays. [ABSTRACT FROM AUTHOR]

Micro‐LED is a novel technology that is believed to be the next generation of display technology after OLED, due to its higher brightness and longer life time. Mass repairing is a key aspect of the micro‐LED technology whose importance lies in the pursuing of a 100% lit screen. Laser assisted repairing attracts a lot of attention and research interests in the industry, due to its pin‐point accuracy for patching of defect and selective repair of pixels at a mass scale on a panel. By employing such laser transfer technology, we achieved selectively releasing of micro‐LED from one carrier onto another carrier, with accuracy of ±2um, through the efforts of optimizing laser energy, and choosing suitable laser release layer and catch layer materials. [ABSTRACT FROM AUTHOR]

Micro‐LED is an emerging technology that is believed to be the next generation of display technology after OLED, due to its higher brightness and longer life time. Mass transfer is a key component towards the mass production of micro‐LED manufacture. Among all efforts to make micro‐LED display a reality, PDMS stamp transprint is the mainstream solution that is, so far, ahead of the game than all the other approaches. A key requirement for PDMS transfer is the quality of the stamp, more specifically, in the aspects of flatness uniformity, sticky force level, materials processing, and size enlarging. Based on these perceptions, we endeavored to achieve a ∼3cm×4cm area stamp that has overall flatness in the order of a few microns, through the efforts of optimizing fabrication hardware, materials processing and designing special tools. [ABSTRACT FROM AUTHOR]