Search

In this publication, the activation and degradation of the passivation quality of plasma-enhanced chemical vapor deposited aluminum oxide (Al2O3) layers with different thicknesses (10 nm, 20 nm, and 110 nm) on crystalline silicon (c-Si) during long and high temperature treatments are investigated. As indicated by Fourier Transform Infrared Spectroscopy, the concentration of tetrahedral and octahedral sites within the Al2O3 layer changes during temperature treatments and correlates with the amount of negative fixed charges at the Si/Al2O3 interface, which was detected by Corona Oxide Characterization of Semiconductors. Furthermore, during a temperature treatment at 820 °C for 30 min, the initial amorphous Al2O3 layer crystallize into the γ-Al2O3 structure and was enhanced by additional oxygen as was proven by x-ray diffraction measurements and underlined by Density Functional Theory simulations. The crystallization correlates with the increase of the optical density up to 20% while the final Al2O3 layer thickness decreases at the same time up to 26%. All observations described above were detected to be Al2O3 layer thickness dependent. These observations reveal novel aspects to explain the temperature induced passivation and degradation mechanisms of Al2O3 layers at a molecular level like the origin of the negative fixe charges at the Si/SiOx/Al2O3 interface or the phenomena of blistering. Moreover, the crystal phase of Al2O3 does not deliver good surface passivation due to a high concentration of octahedral sites leading to a lower concentration of negative fixed charges at the interface. [ABSTRACT FROM AUTHOR]

This work demonstrates the efficient optical and passivation properties provided by hydrogenated silicon nitride (SiNx:H) layers deposited in a lab‐scale atmospheric pressure plasma enhanced chemical vapor deposition (AP‐PECVD) reactor. By applying modulated low‐frequency plasma (200 kHz), homogeneous SiNx:H layers, with small variances in thickness w and refractive index n (Δw ≤ 2 nm; Δn ≤ 0.02), were achieved on a surface area of 45 × 55 mm2. The use of voltage amplitude modulation enabled discharge optimization and led to greatly enhanced SiNx:H film homogeneity and conformity in comparison with continuous plasma discharge conditions. Additionally, AP‐PECVD SiNx:H showed good thermal stability (Δw ≤ 1 nm; Δn ≤ −0.02) with low absorption coefficients (k ≤ 0.1 at 275 nm), demonstrating that such layers could act as efficient antireflective coatings. Furthermore, outstanding surface passivation properties were achieved after firing, both on n‐type FZ c‐Si substrates of standard 2.8 Ω.cm doping (τeff = 1.45 ms) and on highly doped 85 Ω/sq n+ emitters (j0e = 74 ± 2 fA.cm−2). Finally, AP‐PECVD SiNx:H thin films were tested on industrial passivated emitter and rear solar cell (PERC) architectures, where the potential of applying these layers both as efficient rear‐side capping layer and front‐side antireflective coating was demonstrated. The first lab‐scale 40 × 40 mm2 PERC solar cells featuring AP‐PECVD SiNx:H layers led to conversion efficiencies of up to 20.6%. These results pave the way for upscaling the dielectric barrier discharge lab‐scale reactor in an industrial in‐line process, which could provide low‐cost and high‐throughput SiNx:H capping and antireflective layers. [ABSTRACT FROM AUTHOR]

In this paper, we study the influence of modifying the geometry of nanotexture on its electrical properties. Nanotexture is formed by an industrially feasible dry-chemical etching process performed entirely in atmospheric pressure conditions. A surface modification process is developed that allows low surface recombination velocities ( S eff,min ≤ 10 cm/s) on nanotextured surfaces. By simultaneously improving the surface passivation and the emitter diffusion processes, we achieve an equivalent passivation level ( V OC,impl ≥ 670 mV) for nanotextured surfaces to that of reference textured surfaces after applying either PECVD or ALD based deposition techniques. [ABSTRACT FROM AUTHOR]

Abstract: In this work, we present a systematic study of the surface recombination velocity of boron-diffused Si wafer passivated with plasma-enhanced chemical-vapor-deposited (PECVD) AlOx layers. Saturation current densities in the range of 5.2–38fAcm−2 (at 300K) were achieved on planar surfaces. In particular, we present an industrially relevant boron emitter, allowing for about 700mV open circuit voltage on textured surfaces, after a firing process. This high passivation quality could be achieved using AlOx passivation layers deposited by PECVD. The passivation quality is found to be equivalent to AlOx layers deposited by plasma-assisted atomic-layer-deposition. A wide range of surface doping concentration (2.5–70×1018 cm−3) was investigated. The emitters used here allow a high resolution in the determination of the surface recombination velocity upper limit. Our simulations, based on Fermi-Dirac statistics, indicate that only very shallow emitters can be used to further increase the resolution on the determination of the surface recombination velocity. [Copyright &y& Elsevier]

Abstract: We are studying the thermal stability of thick hydrogenated amorphous aluminum oxide (Al2O3) layers (20–50nm) prepared by a high-throughput plasma-enhanced chemical-vapor-deposition (PECVD) technique for the electrical passivation of crystalline silicon surfaces. These passivation layers can be applied alone or covered by a capping layer like amorphous hydrogenated silicon nitride (SiNx) or amorphous hydrogenated silicon oxide (SiOx), also prepared by PECVD. After firing at 870°C for approximately 3s, the layers show blistering for Al2O3 of 30nm or higher, independently from the capping layer. For thinner Al2O3, no blistering can be observed even using scanning electron microscope (SEM). Very long carrier lifetimes up to 900μs was obtained in passivated p-Si (1Ωcm) wafer after annealing and firing, without observing a strong influence of the layer thickness and the capping layer. All the layer stacks, including the stacks with SiNx capping layer, show high negative charge densities in the layer (1–4×1012 cm−2). Additionally, low interface defect densities (∼1011 cm−2 eV−1), which could be achieved with and without a hydrogenated capping layer, were measured even after firing. To explain these phenomena, hydrogen concentration depth profiles were measured by nuclear reaction analysis. These measurements have shown that, at the Al2O3–Si interface, hydrogen atomic concentration ranging 5–7% after annealing and 4% after firing are obtained independently from the capping hydrogen concentration. We conclude that PECVD Al2O3 layers of 20nm or thicker can provide enough hydrogen to passivate the interface defects, even after a high temperature step. However, the layer thickness should be limited to 30nm in order to avoid the blistering. [Copyright &y& Elsevier]

Abstract: This paper focusses in particular on the influence of the layer thickness on the passivation quality, the charge density and the interface defects of PECVD Al2O3 passivation layers on c-Si surfaces. The surface recombination velocity and the interface defect density are observed to increase by decreasing the layer thickness. However, the density of negative charges remains almost constant with values around 3 1012cm-2. An optimal passivation quality is obtained for thicknesses of 15nm and higher. A linear relation between surface recombination velocity and Dit was established, allowing the estimation of the electron capture cross section (σn ∼ 10-13 cm-2). Additionally, we measured the capture cross section of holes and electrons using DLTS measurement. The results are found to be very similar to reported values for silicon dioxide. This supports the idea that the chemical passivation of crystalline silicon by Al2O3 is performed by the interstitial SiO2 layer. [Copyright &y& Elsevier]