1. Energy release rate in the presence of residual and thermal stresses
- Author
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Young Hwan Choi, Seyoung Im, Jeong Soon Park, and Jungdo Kim
- Subjects
Strain energy release rate ,Materials science ,Internal energy ,business.industry ,Applied Mathematics ,Mechanical Engineering ,Mechanics ,Structural engineering ,Condensed Matter Physics ,Residual ,Isothermal process ,Thermodynamic potential ,symbols.namesake ,Mechanics of Materials ,Residual stress ,Modeling and Simulation ,Helmholtz free energy ,Thermal ,symbols ,General Materials Science ,business - Abstract
This paper presents a thermodynamic formulation of the J-integral in the presence of residual stress and thermal stress. First, the Helmholtz free energy and the internal energy are derived considering residual and thermal stresses. With the use of these thermodynamic potentials, the energy release rate, J-integral, is derived for thermo-elastic body with residual stresses in isothermal condition. It is verified that the resulting J-integral in the absence of residual stress is identical with the definition of J reported earlier. Furthermore, it is shown that the J-integral in the presence of residual and thermal stresses does not depend on the integration path and domain.
- Published
- 2015