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Continuous peeling of thin chips and flexible devices from a donor to an acceptor is critical for high-efficiency roll-to-roll (R2R) manufacturing of flexible electronics. Here, we propose an R2R conformal peeling technique for the flexible device-on-substrate electronic assembly. First, a mechanical model is established for flexible multilayer structures conformed on curved surface, such as peeling blade, and the corresponding analytical solution of the interfacial shear stress and peeling stress of the adhesive layer is given. Then, the influence of material property and geometrical size of the device (Young’s modulus of different layers and thickness of various layers), the geometric shape of peeling blade (peeling radius and conformal angle), and R2R process parameters (tension and speed of substrate) are analyzed by the theoretical model and experimental test. The peelability law of delaminating devices from the substrate is established for the conformal peeling process. Finally, the design method for a peeling blade is proposed, and the core is to determine the diameter of the peeling blade. It is proofed by the peeling experiment of multilayer electronic devices in the packaging of radio-frequency identification tags. [ABSTRACT FROM AUTHOR]

Chip picking-up with vacuum sorption is a critical technology in flip-chip packaging for separating chip intactly from donor adhesive tape. With increasing length/thickness ratio of chips, the incomplete separation affects the success rate of this process, even leads to the failure of chips. Here, we present a theoretical model with a bisection algorithm to calculate the effective size of tape that contributes to the crack growth, and introduce an energy release rate and pick-up force to evaluate the ability of thin chip picking-up. The finite-element method with a virtual crack-closure technique is constructed to validate the established process model. The effects of the type of pick-up head, length of chip, thickness, and material of tape on chip picking-up process are also revealed to improve the ability to propagate a crack in the adhesive layer. Furthermore, the crack propagation in the adhesive layer with increasing pick-up displacement is predicted to determine the critical value of the thin chip complete separation from compliant tape. These results suggest that the thinner and more compliant tape should be adopted in the chip picking-up process. [ABSTRACT FROM PUBLISHER]