1. Stress relaxation in ultrafine-grained copper at low homologous temperatures.
- Author
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Isaev, N. V., Hryhorova, T. V., Davydenko, O. A., and Polishchuk, S. S.
- Subjects
STRAINS & stresses (Mechanics) ,MATERIAL plasticity ,STRESS relaxation (Mechanics) ,MAGNETIC fields ,ACTIVATION energy - Abstract
The temperature and rate sensitivity of the flow stress in ultrafine-grained (UFG) copper prepared by equal-channel angular hydroextrusion was studied. Tensile tests and stress relaxation tests were carried out in the temperature range of 77 to 295 K. It was established that, with increasing temperature, the flow stress decreases monotonously, and the activation volume reaches a maximum of ∼190b
3 at a temperature of ∼(200 ± 20) K. The results of the experiment are discussed in terms of two thermally activated plastic deformation mechanisms, namely the intersection of "forest" dislocations and dynamic recovery, which are capable of significantly distorting stress relaxation kinetics in UFG copper. [ABSTRACT FROM AUTHOR]- Published
- 2018
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