5 results on '"Dong, H.J."'
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2. Grain morphology and mechanical strength of high-melting-temperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process.
3. Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures.
4. Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering.
5. Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process.
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