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Nanoscale patterns with high conductivity based on silver nanoparticle inks were fabricated using spray coating method. Through optimizing the solution content and spray operation, accurate nanoscale patterns consisting of silver nanoparticles with a square resistance lower than 1 Ω /cm were obtained. By incorporating in situ sintering to substitute the general post sintering process, the time consumption could be significantly reduced to one sixth, qualifying it for large-scale and cost-effective fabrication of printed electronics. To testify the application of spray-coated silver nanoparticle inks, an inverted polymer solar cell was also fabricated, which exhibited a power conversion efficiency of 2.76%. [ABSTRACT FROM AUTHOR]

Highlights: [•] Mixed stabilizers and reductants resulted in reduced the size of Cu particles. [•] Refined Cu NPs exhibited an enhanced density upon sintering. [•] The enhanced particle density decreased the resistivity of the Cu pattern. [ABSTRACT FROM AUTHOR]

Air-stable Cu nanoparticles (NPs) with an average diameter of 6.5 nm were synthesized under ambient conditions using polyvinylpyrrolidone and cetyltrimethylammonium bromide as a mixed capping agent, for preparing nano-Cu ink applicable for direct writing on photo paper using a roller pen. The size, morphology, and air-stability of the Cu NPs were characterized by TEM, SEM, XRD, etc. The mixed capping agent was effective in reducing the aggregation, size of the Cu NPs and improving their air-stability. The reduced size and enhanced air-stability of the Cu NPs resulted in an improved particle density upon sintering, which was mainly responsible for the increased conductivity of the Cu patterns. The resistivity of Cu patterns sintered at 160 °C for 2 h was 11 ± 0.8 μΩ cm, 6.40 times the bulk resistivity. A sample RFID antenna and a decorative logo were successfully made and the Cu patterns or lines exhibited excellent integrity and good conductivity, which were experimentally tested. [ABSTRACT FROM AUTHOR]

Abstract: This paper investigates fabrication of large-area Ag–Pd conductive patterns on ferrite substrate using laser micro-cladding for microwave device application. The effects of the scan line spacing (i.e., beam overlapping factor) on the quality of the fabricated conductive film were studied in detail. Results showed that surface morphologies and electrical characteristics of laser-sintered conductive films were highly dependent on the value of the scan line spacing and the critical beam overlapping factor lay between 20% and 40%. [ABSTRACT FROM AUTHOR]