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A reliable and low‐cost solution‐processing procedure to synthesize a highly adhesive flexible metal antenna with low resistivity for radio‐frequency identification device (RFID) tags on paper substrates via inkjet printing combined with surface modification and electroless deposition (ELD) is demonstrated in this paper. Through the surface modification of colloidal solution of hydrolyzed stannous chloride and chitosan solution, the paper‐based substrate is able to reduce the penetration rate of ink and further increase the adsorption amount of silver ions, which could create a catalytic activating layer to catalyze the subsequent ELD of a conductive deposited metal antenna. The resulting metal antenna for RFID tags presents good adhesive strength and low resistivity of 2.58 × 10−8 Ω·m after 40 min of ELD, and maintains a reliable reading range of RFID tags even after over 1000 times of bending and mechanical stress. Consequently, the developed technology proposed allows for cheap, efficient, and massive production of metal antenna for paper‐based RFID tags with excellent mechanical and electrical properties. Furthermore, this process is especially advantageous for the fabrication of next‐generation flexible electronic devices based on paper substrates. [ABSTRACT FROM AUTHOR]

Abstract A convenient and eco-friendly approach to fabricate high-quality copper layer on ceramic via surface modification combined with electroless plating is introduced in this paper. Through the surface modification of polydopamine, alumina ceramic substrate is capable of adsorbing silver ions, which could create an activating layer to catalyze the subsequent electroless copper plating (ECP) at low temperature. The finding that modification could obviously enhance the adhesion between substrates and copper layers are evaluated by water contact angle measurement, XPS, FT-IR, SEM, EDS and adhesion tests. Moreover, after 30 min of ECP, the resulting deposited copper layer presents an excellent performance in adhesion (highest level in ASTM D3359) and conduction (up to 4.2 × 107 S ⋅ m−1, nearly 70% of bulk copper). This technology might provide a potential way to realize surface metallization on ceramic substrates applied in electronic circuits and devices. [ABSTRACT FROM AUTHOR]