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The temperature dependencies of hole density and hole mobility of p-type 4H-SiC obtained by Hall effect measurement were theoretically analyzed taking account of its anisotropic valence band structure. The experimental Hall factor, which was derived from the ratio of theoretical hole density to experimental Hall hole density, was reproduced by theoretical Hall factor computed using the valence band structure and relaxation times of scattering mechanisms. The product of the theoretical Hall factor and drift mobility computed by the same transport model agreed well with the experimental Hall mobility. Based on analyses of the results, it was revealed that the temperature dependence of Hall factor can be explained by considering the anisotropic valence band structure along with consideration of anisotropic relaxation times. The contribution of each scattering mechanism was also discussed, and empirical formulas for Hall and drift mobilities are presented. [ABSTRACT FROM AUTHOR]

Enhancement and control of carrier lifetimes in p-type 4H-SiC have been investigated. In this study, thermal oxidation and carbon ion implantation methods, both of which are effective for lifetime enhancement in n-type SiC, were attempted on 147-μm thick p-type 4H-SiC epilayers. Effects of surface passivation on carrier lifetimes were also investigated. The carrier lifetimes in p-type SiC could be enhanced from 0.9 μs (as-grown) to 2.6 μs by either thermal oxidation or carbon implantation and subsequent Ar annealing, although the improvement effect for the p-type epilayers was smaller than that for the n-type epilayers. After the lifetime enhancement, electron irradiation was performed to control the carrier lifetime. The distribution of carrier lifetimes in each irradiated region was rather uniform, along with successful lifetime control in the p-type epilayer in the range from 0.1 to 1.6 μs. [ABSTRACT FROM AUTHOR]

Lattice parameters of high-dose ion-implanted 4H-SiC were investigated with reciprocal space mapping (RSM). N, P, Al, or (C+Si) ions were implanted into lightly doped epilayers to form a (330-520) nm-deep box profile with concentrations of 1019-1020atoms/cm3. After activation annealing at 1800 °C, RSM measurements were conducted. The RSM images for (0008) reflection revealed that high-dose ion implantation causes c-lattice expansion in implanted layers, irrespective of ion species. In addition, crystallographic tilt was observed after high-dose ion implantation. The tilt direction is the same for all the samples investigated; the c-axis of the implanted layers is inclined toward the ascending direction of the off-cut. The c-lattice mismatch and the tilt angle increased as the implantation dose increases, indicating that the implantation damage is responsible for the lattice parameter change. From these results and transmission electron microscopy observation, the authors conclude that the c-lattice mismatch and the crystallographic tilt are mainly caused by secondary defects formed after the ion-implantation and activation-annealing process. [ABSTRACT FROM AUTHOR]

High-efficiency visible light emission in N-and-B-doped 6H-SiC epilayers was observed in photoluminescence measurements at room temperature. The orange-yellow light emission due to the recombination of donor-acceptor pairs (DAPs) has a broad spectrum with a peak wavelength of 576 nm and a full width at half maximum of 110 nm at 250 K. The high B concentration of more than 1018 cm-3 improves the emission efficiency of the DAP recombination at a high temperature. Compared with the photoluminescence spectrum of GaN at 10 K, a high quantum efficiency of 95% was estimated for the highly B-doped sample. From time-resolved photoluminescence measurements, a DAP recombination time of 5.0 ms was obtained, which is in good agreement with the calculated value by the rate equation with the assumption of a 95% internal quantum efficiency. This is quite promising as a light-emitting medium by optical pumping, as well as monolithic light sources combined with nitride-based light-emitting diodes grown on the DA-doped SiC epilayer. [ABSTRACT FROM AUTHOR]

Phonon frequencies of a high-quality AlN layer coherently grown on a 6H-SiC (0001) substrate are investigated by Raman scattering. Owing to the largest strain in our coherent AlN layer among heteroepitaxially grown AlN layers ever reported, phonon frequencies of the E2 (low), E2 (high), and A1 (LO) modes are considerably shifted to 244.5 (−3.3, compared with bulk AlN), 672.1 (+16.3), and 899 (+11)cm-1, respectively. Full widths at half maximum of the phonon modes in the coherent AlN are almost equal to those of high-quality bulk AlN, clearly indicating its high crystalline quality and uniform strain. We discuss accuracy of phonon deformation potentials reported by several other groups thorough comparing our experimental results. [ABSTRACT FROM AUTHOR]

A carbon vacancy defect is one of the most abundant point defects in SiC (as-grown, irradiated, annealed) and of technological importance because the acceptor-like level of a carbon monovacancy (Z 1/2 center: E C – 0.63 eV) works as the primary carrier-lifetime killer in 4H–SiC. The carbon vacancy defects can be preferentially generated by either low-energy electron irradiation or high-temperature treatment in an inert gas ambient. On the other hand, the carbon vacancy defects can be almost eliminated by either a carbon-ion implantation process or thermal oxidation. By combination of these techniques, the density of carbon vacancy defects can be controlled in the wide range from 10 11 cm −3 to 10 15 cm −3 or even higher. [ABSTRACT FROM AUTHOR]

Using electron paramagnetic resonance (EPR), energy levels of the carbon vacancy ( Vc) in 4H-SiC and its negative- U properties have been determined. Combining EPR and deep-level transient spectroscopy we show that the two most common defects in as-grown 4H-SiC--the Z1/2 lifetime-limiting defect and the EH7 deep defect--are related to the double acceptor (2-- |0) and single donor (0|+) levels of Vc, respectively. [ABSTRACT FROM AUTHOR]

Abstract: Impact of step height of silicon carbide (SiC) substrates on heteroepitaxial growth of aluminum nitride (AlN) was investigated. Step-and-terrace structures with various step heights, 6 monolayer (ML), 3ML and 1ML, were formed on 6H–SiC (0001) vicinal substrates by high-temperature gas etching. 2H–AlN layers were grown on the substrate by plasma-assisted molecular-beam epitaxy (MBE) and then these layers were characterized by atomic-force microscopy (AFM) and X-ray diffraction (XRD). High-quality AlN can be grown on SiC substrates with 6ML- and 3ML-height step, while AlN grown on SiC substrates with 1ML-height step exhibited inferior crystalline quality. A model for high-quality AlN growth on SiC substrates with 3ML-height step is proposed. [Copyright &y& Elsevier]