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The rapid post-fabrication trimming of the group index in hybrid chalcogenide-on-silicon Mach-Zehnder interferometers is demonstrated. Index changes of 0.065 are achieved through photo-induced mass transfer in an As10Se90 layer.

A hybrid Mach-Zehnder interferometer with directly bonded LiNbO3 on silicon-on-insulator waveguides is designed and demonstrated. The transfer function of the device shows a pi phase shift subject to an external field of 0.5 V/micro-meter

The low-temperature bonding of lithium-niobate to silicon and of indium-phosphide to silicon is reported. The bonding technique is based on modifications to the surfaces of the substrates to-be-bonded, through the deposition of self-assembled, single layers of organic molecules. Chemical functionalization of the monolayers promotes the subsequent formation of bonds across the interface between the two substrates. The technique could be applicable to the fabrication of hybrid-silicon active photonic devices such as light sources, amplifiers and modulators, which are more difficult to implement solely in the silicon materials platform. Compared with direct molecular bonding methods that are currently being used in the fabrication of such devices, monolayers-assisted bonding provides numerous potential advantages: the functional groups at the monolayers termini can be chosen and adjusted to accommodate specific substrates; the process is carried out at a relatively low temperature of 120–150 °C; the outgassing of by-products may be avoided; lastly, while the bonding interface is only a few nm-thin and does not disrupt optical coupling, it may nevertheless provide a relaxation of the substrate flatness and micro-roughness requirements.

Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.

A versatile procedure for the low-temperature bonding of silicon and indium-phosphide to silicon is proposed and demonstrated. The procedure relies on the deposition and functionalization of self-assembled, single molecular layers on the surface of one substrate, and the subsequent attachment of the monolayer to the surface of the other substrate with or without its own monolayer coating. The process is applicable to the fabrication of hybrid-silicon, active photonic devices.