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Abstract: We experimentally demonstrate a high-speed differential phase shift keying (DPSK) modulation using a silicon push–pull operated dual-drive Mach Zehnder modulator (MZM) based on carrier depletion. 5Gbit/s and 10Gbit/s error-free modulation is demonstrated by demodulating the generated DPSK modulated signal using a demodulation circuit based on a polarization delay interferometer through the use of a differential group delay (DGD). Furthermore, the potential for higher DPSK modulation speeds up to 20Gbit/s is also demonstrated. The obtained results validate the potential to achieve higher order modulation formats, such as quadrature phase shift keying (QPSK), by arranging the MZM in a nested configuration. [Copyright &y& Elsevier]

Abstract: We bonded quantum well InP dies on a photonic layer transferred on silicon CMOS processed wafer using direct molecular bonding. This approach is suitable for new applications, viz., photonics on silicon, 3D packaging and integrated sensors. The chips are diced from a bulk substrate and bonded directly onto a silicon substrate without any organic nor metallic adhesive layer. A thin silicon dioxide layer can be added on both assembled surfaces to enhance bonding quality. After bonding, the dies can mechanically be thinned down to 20μm and chemically etched. The InAsP quantum well stack of the InP dies keeps its optoelectronics features and performances after being transferred onto a silicon substrate. [Copyright &y& Elsevier]