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1. Signal analysis of a double-diode autodyne

Author

A. P. Chupahin, G. P. Ermak, V. Ya. Noskov, K. A. Ignatkov, Sergey M. Smolskiy, A. S. Vasiliev, and The present paper is prepared in accordance with an Agreement on scientific-technological cooperation between IRE NASU, UrFU and NRU 'MPEI', as well as at financial support of Russian Federation Government, order No. 211, contract # 02.A03.21.0006.

Subjects
010302 applied physics, Coupling, Physics, Signal processing, Autodyne, business.industry, Acoustics, Electrical engineering, 020206 networking & telecommunications, 02 engineering and technology, Flange, 01 natural sciences, Signal, law.invention, autodyne, autodyne signal, autodyne response, double-diode autodyne, mutual locking, partial oscillator, law, Q factor, 0103 physical sciences, 0202 electrical engineering, electronic engineering, information engineering, Radar, business, Diode
Abstract

Analysis results of autodyne signals of the double-diode oscillator, which is under influence of the proper reflected emission from the moving object, are presented. The analysis is performed on the base of the autodyne mathematical model presented in the form of a system of two mutually-locked partial oscillators under condition of strong mutual coupling. Peculiarities of signal formation are considered for various parameters of partial oscillators and coupling conditions. Experimental data are obtained for the 8mm-range Gunn double-diode oscillator of the flange type.

Published
2017

2. The milling process monitoring using 3D envelope method

Author

Miron Zapciu, Claudiu-Florinel Bisu, Olivier Cahuc, Alain Gérard, Machines and Production Systems Department (MPS), University Politehnica of Bucharest [Romania] (UPB), Institut de Mécanique et d'Ingénierie de Bordeaux (I2M), Institut National de la Recherche Agronomique (INRA)-Université de Bordeaux (UB)-École Nationale Supérieure d'Arts et Métiers (ENSAM), Arts et Métiers Sciences et Technologies, HESAM Université (HESAM)-HESAM Université (HESAM)-Arts et Métiers Sciences et Technologies, HESAM Université (HESAM)-HESAM Université (HESAM)-Institut Polytechnique de Bordeaux-Centre National de la Recherche Scientifique (CNRS), and This paper was supported by CNCSIS-UEFISCSU, project PNII-RUcode194/2010 and by CNRS UMR 5295

Subjects
FOS: Computer and information sciences, 0209 industrial biotechnology, Engineering drawing, Engineering, Other Computer Science (cs.OH), [PHYS.MECA.GEME]Physics [physics]/Mechanics [physics]/Mechanical engineering [physics.class-ph], Mechanical engineering, 02 engineering and technology, Signal, Milling monitoring, symbols.namesake, 3D Envelope method, 020901 industrial engineering & automation, 0203 mechanical engineering, Computer Science - Other Computer Science, Protocol (object-oriented programming), Vibration analysis, business.industry, General Engineering, Process (computing), [SPI.MECA.GEME]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanical engineering [physics.class-ph], Characterization (materials science), Vibration, 020303 mechanical engineering & transports, Envelope method, symbols, Milling process, Hilbert transform, business, Envelope (motion)
Abstract

International audience; This paper proposes a method to vibration analysis in order to on-line monitoring of milling process quality. Adapting envelope analysis to characterize the milling tool materials is an important contribution to the qualitative and quantitative characterization of milling capacity and a step by modeling the three-dimensional cutting process. An experimental protocol was designed and developed for the acquisition, processing and analyzing three-dimensional signal. The vibration envelope analysis is proposed to detect the cutting capacity of the tool with the optimization application of cutting parameters. The research is focused on Hilbert transform optimization to evaluate the dynamic behavior of the machine/ tool/workpiece.

Published
2012