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The paper presents several types of thermal barrier type ceramic layers and the variations concerningtheir porosity and adherence related with their chemical composition. The structural and compositionalcharacterization of the obtained layers was performed by electron microscopy, one of the most relevantinvestigation methods in order to choose the optimum composition for the external layer deposited on copperdevices. The effect of quick thermal shock on the samples porosity and on chemical elements distribution alongthe layer’s thickness was also taken into account.

The paper presents several types of thermal barrier type ceramic layers and the variations concerning their porosity and adherence related with their chemical composition. The structural and compositional characterization of the obtained layers was performed by electron microscopy, one of the most relevant investigation methods in order to choose the optimum composition for the external layer deposited on copper devices. The effect of quick thermal shock on the samples porosity and on chemical elements distribution along the layer's thickness was also taken into account. [ABSTRACT FROM AUTHOR]